Abstract: Techniques for acquiring an electron energy loss spectrum in two dimensions are disclosed herein. The technique at least includes exposing an electron sensor to an electron spectrum projected in two dimensions, wherein one of the two dimensions corresponds to a dispersive axis, and the other of the two dimensions corresponds to a non-dispersive axis, receiving an electron sensor readout frame from the electron sensor, where the electron sensor readout frame comprises a plurality of values representative of the electron spectrum in each of the two dimensions, and reducing a resolution of the electron sensor readout frame in at least one of the two dimensions, where reducing the resolution includes reducing the number of values in the at least one of the two dimensions, where the electron sensor readout frame comprises a plurality of values in each of the two dimensions after the reduction in resolution.

Abstract: Disclosed is a method of using a charged particle microscope for inspecting a sample mounted on a sample holder. The microscope is equipped with a solid state detector for detecting secondary particles emanating from the sample in response to irradiation of the sample with the primary beam, with the solid state detector in direct optical view of the sample. In some embodiments, the sample is mounted on a heater with a fast thermal response time. The method comprises contactless measurement of the temperature of the sample and/or sample holder using the solid state detector.

Abstract: Methods and systems are provided for a scanning microscope to rapidly form a partial digital image of an area. The method includes performing an initial scan for the area and using initial scan to identify regions representing features of interest in the area. Then, the method performs additional adaptive scans of the regions representing structures of interest. Such scans adapt the path of the scanning beam to follow the edges of a feature of interest by performing localized scan patterns that intersect the feature edge, and directing the localized scan patterns to follow the feature edge.

Abstract: Methods and systems are provided for a scanning microscope to rapidly form a partial digital image of an area. The method includes performing an initial scan for the area and using initial scan to identify regions representing features of interest in the area. Then, the method performs additional adaptive scans of the regions representing structures of interest. Such scans adapt the path of the scanning beam to follow the edges of a feature of interest by performing localized scan patterns that intersect the feature edge, and directing the localized scan patterns to follow the feature edge.

Abstract: Disclosed is a method of using a charged particle microscope for inspecting a sample mounted on a sample holder. The microscope is equipped with a solid state detector for detecting secondary particles emanating from the sample in response to irradiation of the sample with the primary beam, with the solid state detector in direct optical view of the sample. In some embodiments, the sample is mounted on a heater with a fast thermal response time. The method comprises contactless measurement of the temperature of the sample and/or sample holder using the solid state detector.

Abstract: A multi-beam apparatus for inspecting or processing a sample with a multitude of focused beams uses a multitude of detectors for detecting secondary radiation emitted by the sample when is irradiated by the multitude of beams. Each detector signal comprises information caused by multiple beams, the apparatus equipped with a programmable controller for processing the multitude of detector signals to a multitude of output signals, using weight factors so that each output signal represents information caused by a single beam. The weight factors are dynamic weight factors depending on the scan position of the beams with respect to the detectors and the distance between sample and detectors.

Abstract: A method for forming microscopic 3D structures. In the method according to the invention a substrate (105) is placed in a Scanning Electron Microscope (SEM). The SEM is equipped with a Gas Injection System (GIS) (110) for directing a jet of precursor fluid to the substrate. The substrate is cooled below the freezing point of the precursor gas so that a frozen layer of the precursor gas can be applied to the substrate. By now repeatedly applying a frozen layer of the precursor to the substrate and irradiate the frozen layer with an electron beam (102), a stack of frozen layers (130) is built, each layer showing an irradiated part (131) in which the precursor is converted to another material. After applying the last layer the temperature is raised so that the unprocessed precursor (132) can evaporate. As a result 3D structures with overhanging features can be built.

Abstract: Dual beam instruments, comprising a Scanning Electron Microscope (SEM) column for imaging and a Focused Ion Beam (FIB) column for milling, are routinely used to extract samples (lamellae) from semiconductor wafers. By observing the progress of the milling with the SEM column, end pointing of the milling process can be performed. The invention offers an alternative solution to this problem, in which an instrument with only a FIB column is used. For milling a lamella to its final thickness of, for example, 30 nm, the focused ion beam 100, is scanned repeatedly along the lamella. It is found that while milling the lamella a signal can be derived from the lamella that is sufficient for end pointing. No additional electron beam for inspection is needed.

Abstract: A method for forming microscopic 3D structures. In the method according to the invention a substrate (105) is placed in a Scanning Electron Microscope (SEM). The SEM is equipped with a Gas Injection System (GIS) (110) for directing a jet of precursor fluid to the substrate. The substrate is cooled below the freezing point of the precursor gas so that a frozen layer of the precursor gas can be applied to the substrate. By now repeatedly applying a frozen layer of the precursor to the substrate and irradiate the frozen layer with an electron beam (102), a stack of frozen layers (130) is built, each layer showing an irradiated part (131) in which the precursor is converted to another material. After applying the last layer the temperature is raised so that the unprocessed precursor (132) can evaporate. As a result 3D structures with overhanging features can be built.

Abstract: Dual beam instruments, comprising a Scanning Electron Microscope (SEM) column for imaging and a Focused Ion Beam (FIB) column for milling, are routinely used to extract samples (lamellae) from semiconductor wafers. By observing the progress of the milling with the SEM column, end pointing of the milling process can be performed. The invention offers an alternative solution to this problem, in which an instrument with only a FIB column is used. For milling a lamella to its final thickness of, for example, 30 nm, the focused ion beam 100, is scanned repeatedly along the lamella. It is found that while milling the lamella a signal can be derived from the lamella that is sufficient for end pointing. No additional electron beam for inspection is needed.

Abstract: An optical microscope slide in a charged particle instrument such as an electron microscope or a focused ion beam instrument. Conventional microscope slides are not fit for use in an electron microscope as they are insulating and would thus charge when viewed in an electron microscope due to the impinging beam of charged particles. However, microscope slides exist that show a coating with a conductive layer of e.g. Indium Tin Oxide (ITO). These microscope slides are normally used for heating the object mounted on the slide by passing a current through the conductive layer. Experiments show that these microscope slides can be used advantageously in a charged particle instrument by connecting the conductive layer to e.g. ground potential, thereby forming a return path for the impinging charged particles and thus avoiding charging. The invention further relates to a charged particle instrument that is further equipped with an optical microscope.

Abstract: An optical microscope slide in a charged particle instrument such as an electron microscope or a focused ion beam instrument. Conventional microscope slides are not fit for use in an electron microscope as they are insulating and would thus charge when viewed in an electron microscope due to the impinging beam of charged particles. However, microscope slides exist that show a coating with a conductive layer of e.g. Indium Tin Oxide (ITO). These microscope slides are normally used for heating the object mounted on the slide by passing a current through the conductive layer. Experiments show that these microscope slides can be used advantageously in a charged particle instrument by connecting the conductive layer to e.g. ground potential, thereby forming a return path for the impinging charged particles and thus avoiding charging. The invention further relates to a charged particle instrument that is further equipped with an optical microscope.

Abstract: The invention describes a method of positioning an image field of, for example, an electron microscope at a specific structure in a regular grid of nominally identical structures. Such structures can, for example, be memory cells on a chip. Such memory cells nowadays have an area of, for example, less than 1 ?m2, and are arranged in a grid of 1000*1000 cells. During displacement, an error can occur that is larger than a grid distance of the structures, as a result of which the image field is adjusted to a structure other than the intended one. The displacement can be sub-divided into a large number of component displacements, whereby the error per component displacement is smaller than half a grid distance. By now determining the displacement after each component displacement, the error per component displacement can be eliminated. This method lends itself to automation, whereby the image displacements are determined with the aid of correlation techniques.