Patents by Inventor Jacob Stafford

Jacob Stafford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer chuck and method
    Patent number: 9349602
    Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: May 24, 2016
    Assignee: JST MANUFACTURING, INC.
    Inventors: Jacob Stafford, David Campion, Travis Deleve, Jason Boyd
  • SEMICONDUCTOR WAFER CHUCK AND METHOD
    Publication number: 20140322919
    Abstract: A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.
    Type: Application
    Filed: April 24, 2014
    Publication date: October 30, 2014
    Applicant: JST Manufacturing Inc.
    Inventors: Jacob Stafford, David Campion, Travis Deleve, Jason Boyd