Patents by Inventor Jacob Stelman

Jacob Stelman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for reliably transferring signals between electronic components
    Patent number: 11809142
    Abstract: An electronic hinge system is provided, including a first component and a second component. The first component may include a first enclosure, a first substrate extending within the first enclosure, a first connector, and a plurality of curved elements disposed in the first connector. The first substrate may have electrically conductive elements and microelectronic devices electrically connected with the electrically conductive elements. The curved elements may be electrically conductive and spaced apart from one another. Each curved element may be electrically connected with a respective one of the electrically conductive elements of the first component. The second component may include a second enclosure and a second connector disposed at an end of the second enclosure. The first connector may be configured to mate with the second connector, such that when the first component is engaged with the second component, the first connector is rotationally coupled with the second connector.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: November 7, 2023
    Assignee: Google LLC
    Inventors: Marc Thomas, Jacob Stelman
  • Method and Apparatus for Reliably Transferring Signals Between Electronic Components
    Publication number: 20210373506
    Abstract: An electronic hinge system is provided, including a first component and a second component. The first component may include a first enclosure, a first substrate extending within the first enclosure, a first connector, and a plurality of curved elements disposed in the first connector. The first substrate may have electrically conductive elements and microelectronic devices electrically connected with the electrically conductive elements. The curved elements may be electrically conductive and spaced apart from one another. Each curved element may be electrically connected with a respective one of the electrically conductive elements of the first component. The second component may include a second enclosure and a second connector disposed at an end of the second enclosure. The first connector may be configured to mate with the second connector, such that when the first component is engaged with the second component, the first connector is rotationally coupled with the second connector.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Inventors: Marc Thomas, Jacob Stelman
  • Method and apparatus for reliably transferring signals between electronic components
    Patent number: 11092933
    Abstract: An electronic hinge system is provided, including a first component and a second component. The first component may include a first enclosure, a first substrate extending within the first enclosure, a first connector, and a plurality of curved elements disposed in the first connector. The first substrate may have electrically conductive elements and microelectronic devices electrically connected with the electrically conductive elements. The curved elements may be electrically conductive and spaced apart from one another. Each curved element may be electrically connected with a respective one of the electrically conductive elements of the first component. The second component may include a second enclosure and a second connector disposed at an end of the second enclosure. The first connector may be configured to mate with the second connector, such that when the first component is engaged with the second component, the first connector is rotationally coupled with the second connector.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: August 17, 2021
    Assignee: Google LLC
    Inventors: Marc Thomas, Jacob Stelman
  • Method and Apparatus for Reliably Transferring Signals Between Electronic Components
    Publication number: 20200096947
    Abstract: An electronic hinge system is provided, including a first component and a second component. The first component may include a first enclosure, a first substrate extending within the first enclosure, a first connector, and a plurality of curved elements disposed in the first connector. The first substrate may have electrically conductive elements and microelectronic devices electrically connected with the electrically conductive elements. The curved elements may be electrically conductive and spaced apart from one another. Each curved element may be electrically connected with a respective one of the electrically conductive elements of the first component. The second component may include a second enclosure and a second connector disposed at an end of the second enclosure. The first connector may be configured to mate with the second connector, such that when the first component is engaged with the second component, the first connector is rotationally coupled with the second connector.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Marc Thomas, Jacob Stelman