Patents by Inventor Jacob Tamasy

Jacob Tamasy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969788
    Abstract: A method of manufacturing an antenna assembly includes additively manufacturing an element that is a monolithic structure and that includes (i) a ground plane including one or more aperture slots, (ii) a patch antenna above the ground plane, and (iii) a sacrificial support feature to support the patch antenna above the ground plane. The method further includes applying a dielectric material between the ground plane and the patch antenna. In an example, applying the dielectric material between the ground plane and the patch antenna includes providing a dielectric foam between the ground plane and the patch antenna, where the dielectric foam at least in part supports the patch antenna above the ground plane. The method further includes removing at least a section of the sacrificial support feature, such that any remnant of the support feature does not physically couple the ground plane to the patch antenna.
    Type: Grant
    Filed: January 25, 2023
    Date of Patent: April 30, 2024
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Jean L. Kubwimana, Alexander D. Johnson, Jacob Tamasy, James F. Fung, Matthew J. Ney
  • Publication number: 20230178895
    Abstract: A stacked patch antenna is expandable from a thinner stowed configuration in which the gaps between the conductor layers are reduced, to a thicker deployed configuration in which the gaps are expanded to their required dimensions. The expansion mechanism can include rotation of threaded rods, pneumatic expansion of telescoping rods, and/or injection of a gas, a chemical sublimate, and/or an expandable foam into the gaps. In embodiments, the stowed thickness of the antenna can be approximately equal to the sum of the thicknesses of the conductor panels. In some of these embodiments high dielectric layers are not included. In other of these embodiments high dielectric layers are formed by filling gaps with a high dielectric foam. Embodiments implement aperture coupling to the stacked patch antenna. An array of the stacked patch antennae can be folded about a satellite until deployment, and can be planar when unfolded and deployed.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 8, 2023
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Alexander D. Johnson, Jonathan E. Epstein, Jacob Tamasy