Patents by Inventor Jacob Tamasy

Jacob Tamasy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240283124
    Abstract: An antenna assembly includes an antenna feed, a ground plane, a first antenna element, a second antenna element, and a shorting post that is shared between the first and second antenna elements. The first antenna element includes a first conductive dipole arm in planar alignment with a surface of the ground plane and a second conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the first conductive dipole arm. The second antenna element includes a third conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the second conductive dipole arm, and a fourth conductive dipole arm in planar alignment with the surface of the ground plane and adjacent to the third conductive dipole arm. The shorting post is in electrical communication with the ground plane, the second conductive dipole arm and the third conductive dipole arm.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Jean L. Kubwimana, Jacob Tamasy, Alexander D. Johnson
  • Publication number: 20240283134
    Abstract: A device includes a frame and at least one printed circuit board attached to the frame. The frame includes an integrated aperture antenna array and an antenna feed in electrical communication with the at least one printed circuit board. The integrated aperture antenna array further includes a first conductive dipole arm in planar alignment with a surface of the frame; a second conductive dipole arm in planar alignment with the surface of the frame and adjacent to the first conductive dipole arm; a first feedline in electrical communication with the first conductive dipole arm and the antenna feed; a second feedline in electrical communication with the second conductive dipole arm and the surface of the frame; and a shorting arm in electrical communication with second conductive dipole arm and the frame.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Jacob Tamasy, Matthew A. Cerniway, Alexander D. Johnson
  • Publication number: 20240283168
    Abstract: An antenna assembly includes at least one conductive dipole arm and an adjacent conductive wall (“H-wall”), which enables efficient radiation from the conductive dipole arm without added losses. A single-ended antenna feed is configured to receive a single-ended signal. The antenna assembly further includes a ground plane and a conductive dipole arm in planar alignment with a surface of the ground plane. The conductive wall is electrically coupled with the ground plane and has an end adjacent to, and physically separate from, the conductive dipole arm, an axial length of the H-wall being orthogonal to the ground plane. The antenna assembly further includes a feedline electrically coupled with the conductive dipole arm and the single-ended antenna feed.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Jacob Tamasy, Alexander D. Johnson, James F. Fung
  • Publication number: 20240250430
    Abstract: An antenna assembly includes a first dielectric material, a ground plane above the first dielectric material, and two or more patch antennas above the ground plane. In an example, the ground plane has a first aperture slot, and a second aperture slot that is non-intersecting with the first aperture slot. The antenna assembly further includes a second dielectric material separating the two or more patch antennas from the ground plane. In an example, the first dielectric material comprises a printed circuit board (PCB). In some examples, the ground plane and the two or more patch antennas are manufactured using additive manufacturing techniques (such as three-dimensional printing techniques), and in some such examples, the second dielectric material includes dielectric foam. For example, the dielectric foam supports the two or more patch antennas above the ground plane.
    Type: Application
    Filed: January 25, 2023
    Publication date: July 25, 2024
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Jean L. Kubwimana, Alexander D. Johnson, Jacob Tamasy, James F. Fung, Matthew J. Ney
  • Publication number: 20240250431
    Abstract: An antenna assembly includes a ground plane having a first aperture slot and a second aperture slot. The first and second aperture slots are non-intersecting and substantially symmetrical with each other about an imaginary plane of symmetry that divides the ground plane into two substantially symmetrical halves, and that is orthogonal to the ground plane. The antenna assembly includes a first patch antenna above the ground plane, and a second patch antenna above the first patch antenna. The first patch antenna is separated from the ground plane, and the second patch antenna is separated from the first patch antenna. The imaginary plane also divides the first patch antenna into two substantially symmetrical halves, and divides the second patch antenna into two substantially symmetrical halves. A first feed line and a second feed line are at least in part below the first aperture slot and the second aperture slot, respectively.
    Type: Application
    Filed: January 25, 2023
    Publication date: July 25, 2024
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Jean L. Kubwimana, Alexander D. Johnson, Jacob Tamasy
  • Patent number: 11969788
    Abstract: A method of manufacturing an antenna assembly includes additively manufacturing an element that is a monolithic structure and that includes (i) a ground plane including one or more aperture slots, (ii) a patch antenna above the ground plane, and (iii) a sacrificial support feature to support the patch antenna above the ground plane. The method further includes applying a dielectric material between the ground plane and the patch antenna. In an example, applying the dielectric material between the ground plane and the patch antenna includes providing a dielectric foam between the ground plane and the patch antenna, where the dielectric foam at least in part supports the patch antenna above the ground plane. The method further includes removing at least a section of the sacrificial support feature, such that any remnant of the support feature does not physically couple the ground plane to the patch antenna.
    Type: Grant
    Filed: January 25, 2023
    Date of Patent: April 30, 2024
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Jean L. Kubwimana, Alexander D. Johnson, Jacob Tamasy, James F. Fung, Matthew J. Ney
  • Publication number: 20230178895
    Abstract: A stacked patch antenna is expandable from a thinner stowed configuration in which the gaps between the conductor layers are reduced, to a thicker deployed configuration in which the gaps are expanded to their required dimensions. The expansion mechanism can include rotation of threaded rods, pneumatic expansion of telescoping rods, and/or injection of a gas, a chemical sublimate, and/or an expandable foam into the gaps. In embodiments, the stowed thickness of the antenna can be approximately equal to the sum of the thicknesses of the conductor panels. In some of these embodiments high dielectric layers are not included. In other of these embodiments high dielectric layers are formed by filling gaps with a high dielectric foam. Embodiments implement aperture coupling to the stacked patch antenna. An array of the stacked patch antennae can be folded about a satellite until deployment, and can be planar when unfolded and deployed.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 8, 2023
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Alexander D. Johnson, Jonathan E. Epstein, Jacob Tamasy