Abstract: A processing system concurrency optimization system includes a processing system having first and second processing subsystems, a power system that is coupled to the first and second processing subsystems, a processing system concurrency optimization database, and a processing system concurrency optimization subsystem that is coupled to the power system and the processing system concurrency optimization database. The processing system concurrency optimization subsystem determines that a first workload has been provided for performance by the processing system, and identifies a first processing system concurrency optimization profile that is associated with the first workload in the processing system concurrency optimization database.

Abstract: A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generate a second airflow that is that is directed into the chassis. A board in the chassis includes a first board section located adjacent the first fan system, and a second board section located adjacent the second fan system and configured to receive the second airflow. The first board section includes first components that are thermally coupled to the heat dissipation device(s) and that are configured to operate in a first temperature range, and the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.

Abstract: A computing device cooling system includes a chassis including chassis surface(s). The chassis houses component(s), chassis surface temperature sensor(s) configured to report a chassis surface temperature associated with the chassis surface(s), component temperature sensor(s) configured to report a component temperature associated with the component(s); a first fan system configured to generate a component cooling airflow that reduces the component temperature of the component(s), and a second fan system configured to generate a chassis surface cooling airflow that reduces the chassis surface temperature of the chassis surface(s). A fan control system is coupled to the chassis surface temperature sensor(s), the component temperature sensor(s), the first fan system, and the second fan system.

Abstract: A computing cooling system includes a chassis having chassis air inlet(s) and outlet(s). Heat dissipation device(s) thermally coupled to heat producing component(s) are located in the chassis adjacent the chassis air outlet(s). A first fan device located in the chassis adjacent the chassis air inlet(s) pulls first air from outside the chassis into the first fan device via the chassis air inlet(s), and pushes the first air though the heat dissipation device(s) and out of the chassis via the chassis air outlet(s). A second fan device located in the chassis adjacent the chassis air inlet(s) pulls second air from outside the chassis into the second fan device via the chassis air inlet(s), pushes a first portion of the second air past the heat dissipation device(s) and out of the chassis via the chassis air outlet(s), and pushes a second portion of the second air into the chassis.

Abstract: A networked system includes a first computing device, second computing devices, and a computing device/application performance optimization system that are all coupled to a network. The computing device/application performance optimization system receives second computing device configuration information for each second computing device while they provided a first application, and second computing device performance information generated by each second computing device in response to providing the first application, and uses them to generate a first computing device/application performance profile.

Abstract: A processing system concurrency optimization system includes a processing system having first and second processing subsystems, a power system that is coupled to the first and second processing subsystems, a processing system concurrency optimization database, and a processing system concurrency optimization subsystem that is coupled to the power system and the processing system concurrency optimization database. The processing system concurrency optimization subsystem determines that a first workload has been provided for performance by the processing system, and identifies a first processing system concurrency optimization profile that is associated with the first workload in the processing system concurrency optimization database.

Abstract: A networked system includes a first computing device, second computing devices, and a computing device/application performance optimization system that are all coupled to a network. The computing device/application performance optimization system receives second computing device configuration information for each second computing device while they provided a first application, and second computing device performance information generated by each second computing device in response to providing the first application, and uses them to generate a first computing device/application performance profile.

Abstract: A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generate a second airflow that is that is directed into the chassis. A board in the chassis includes a first board section located adjacent the first fan system, and a second board section located adjacent the second fan system and configured to receive the second airflow. The first board section includes first components that are thermally coupled to the heat dissipation device(s) and that are configured to operate in a first temperature range, and the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.

Abstract: A computing device cooling system includes a chassis including chassis surface(s). The chassis houses component(s), chassis surface temperature sensor(s) configured to report a chassis surface temperature associated with the chassis surface(s), component temperature sensor(s) configured to report a component temperature associated with the component(s); a first fan system configured to generate a component cooling airflow that reduces the component temperature of the component(s), and a second fan system configured to generate a chassis surface cooling airflow that reduces the chassis surface temperature of the chassis surface(s). A fan control system is coupled to the chassis surface temperature sensor(s), the component temperature sensor(s), the first fan system, and the second fan system.

Abstract: A computing cooling system includes a chassis having chassis air inlet(s) and outlet(s). Heat dissipation device(s) thermally coupled to heat producing component(s) are located in the chassis adjacent the chassis air outlet(s). A first fan device located in the chassis adjacent the chassis air inlet(s) pulls first air from outside the chassis into the first fan device via the chassis air inlet(s), and pushes the first air though the heat dissipation device(s) and out of the chassis via the chassis air outlet(s). A second fan device located in the chassis adjacent the chassis air inlet(s) pulls second air from outside the chassis into the second fan device via the chassis air inlet(s), pushes a first portion of the second air past the heat dissipation device(s) and out of the chassis via the chassis air outlet(s), and pushes a second portion of the second air into the chassis.