Abstract: A method is provided. The method of resetting a system, comprising: receiving data from the electronic sub-system; determine if a non-hardware fault is detected; if a non-hardware fault is detected, then performing a software reset of the electronics sub-system; if no non-hardware fault has been detected, then determining if a hardware fault is detected; and if a hardware fault is detected, then performing a hardware reset of the system.

Abstract: A method is provided. The method of resetting a system, comprising: receiving data from the electronic sub-system; determine if a non-hardware fault is detected; if a non-hardware fault is detected, then performing a software reset of the electronics sub-system; if no non-hardware fault has been detected, then determining if a hardware fault is detected; and if a hardware fault is detected, then performing a hardware reset of the system.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: A packaging assembly includes a printed circuit assembly coupled to a stiffening device, which may take the form of a custom-shaped stiffening member or take the form of a support member having spokes attached to a rim. The printed circuit assembly includes a printed circuit board with a number of electrical components extending from a surface of the board. The stiffening member or the support member includes openings that receive the electrical components while providing additional stiffness to the board.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: An inertial measurement unit includes a housing with openings to permit fluid communication between at least one pressure source and two distinct cavities within the housing. The cavities are separated by an inertial sensor assembly coupled to a vibration isolator assembly. The pressure in the cavities may be adjusted or tuned to change a natural frequency of the inertial measurement unit, thus allowing the unit to be configured and even optimized for a variety of different applications. By adjusting the pressure in the respective cavities, gas squeeze film damping effects may be optimized when the inertial measurement unit undergoes a shock event and/or when the inertial measurement unit experiences vibration loads during operation. In one embodiment, the vibration isolator assembly includes perforations to permit fluid communication between the first and second cavities during specific operational events.

Abstract: A packaging assembly includes a printed circuit assembly coupled to a stiffening device, which may take the form of a custom-shaped stiffening member or take the form of a support member having spokes attached to a rim. The printed circuit assembly includes a printed circuit board with a number of electrical components extending from a surface of the board. The stiffening member or the support member includes openings that receive the electrical components while providing additional stiffness to the board.