Abstract: A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is realized in that the interface (24) encloses a delamination area (22), which area (22) is isolated from any bond pads (18) of the integrated circuit (10). The delamination area (22) may be created by a pattern-wise activation of a surface of the inner layer (21). A quantity of a curable polymer may be disposed on this surface to achieve this.

Abstract: A lithographic apparatus contains an optical element, the surface of the optical element being modified to reduce the effects of reflectivity reduction by molecular contamination. The surface includes a self assembled monolayer.

Abstract: A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is realized in that the interface (24) encloses a delamination area (22), which area (22) is isolated from any bond pads (18) of the integrated circuit (10). The delamination area (22) may be created by a pattern-wise activation of a surface of the inner layer (21). A quantity of a curable polymer may be disposed on this surface to achieve this.

Abstract: An EUV lithographic apparatus contains an optical element, the surface of the optical element being modified to reduce the effects of reflectivity reduction by molecular contamination. The surface is modified such that it includes a self assembled monolayer.

Abstract: An EUV lithographic apparatus contains an optical element, the surface of the optical element being modified to reduce the effects of reflectivity reduction by molecular contamination. The surface is modified such that it includes a self assembled monolayer.

Abstract: The invention relates to an electromotor comprising a stator part and a rotor part, which parts form an oil-containing spiral groove bearing system. Surface areas of said parts are provided with a so-called oil barrier in order to prevent the oil from creeping from the bearing system to the environment. According to the present invention, said oil barrier comprises a monolayer of perfluorocarboxylic acid anions, especially those having a chain length of 10-20 C-atoms and/or perfluoroalkylthiol anions. Oil barriers of this type can be easily provided on the rotor part and stator part by means of dipping. These oil barriers have a very small thickness and can very suitably be used to prevent oil creepage.

Abstract: An X-ray examination apparatus (1) includes a filter (4) which is arranged between the X-ray source (2) and the X-ray detector (3). The X-ray filter includes a large number of filter elements (5); the X-ray absorptivity of the filter elements can be adjusted by controlling the quantity of X-ray absorbing liquid (6) than individual filter elements. The filter elements are formed by metal capillary tubes or the wall of the capillary tubes, or the wall of the capillary tubes is provided with a metal layer (7). On the metal layer there is provided a dielectric layer (8) and the dielectric layer is covered by a coating layer (9). The dielectric layer is, for example a glass, parylene or polystyrene layer. The coating layer is, for example a Teflon, silane or siloxane layer. The dielectric layer can be dispensed with when a Teflon coating layer is used.

Abstract: A method of providing an ultra-thin (<1 nm) silicon-oxide layer on a substrate surface, for example, of a metal. A film of a solution of a polyorganosiloxane is applied to the substrate surface. After drying, the polyorganosiloxane is completely converted to said silicon-oxide layer by means of an UV-ozone treatment. Such an ultra-thin silicon-oxide layer sufficiently protects a metal surface against corrosion. In addition, the silicon-oxide layer can be silanized with the customary silane coupling agents to improve the bond with polymers. The method can very suitably be used, for example, to treat metal leadframes for ICs and to provide a bonding layer for indium tin oxide on polyacrylate for a passive plate of LC displays.

Abstract: The invention relates to an opto-electronic coupler comprising an optical transmitter and an optical receiver which are secured to separate connection conductors and which are electrically connected to one or more connection conductors via contact wires, the transmitter, the receiver, the contact wires and parts of the connection conductors being embedded in a primary, enveloping body, and said primary enveloping body being embedded in a secondary, non-transparent enveloping body. Couplers having a high breakdown voltage and a low percentage of rejects are obtained if the interface between the primary enveloping body and the secondary enveloping body comprises at least one zone in which the primary and the secondary enveloping bodies are adhesively interconnected, and if the interface also comprises at least one zone in which the primary and the secondary enveloping bodies are interconnected in a non-adhesive manner.

Abstract: A method of manufacturing an optical master disk, matrix derived from the master disk and synthetic resin information disk derived from the matrix.A method of manufacturing an optical master disk in which a supporting plate is provided on one side with at least two layers of a photosensitive material in which, taken from the supporting plate, the photosensitivity of the material of the layers increases and/or in which a light-absorbing separation layer is used between the layers, as well as a metal matrix derived from the master disk and an optically readable information disk of synthetic resin derived from the matrix.

Abstract: A method of applying a resist pattern on a substrate and resist material mixture.Resist materials which are applied in accordance with a specific resist pattern are employed in the production of integrated circuits. It has been found that the addition of a certain type of negative-working resist material, namely polystyrene and polystyrene derivatives, to positive-working resist materials results in a resist material mixture having an increased resistance to plasma etching.