Patents by Inventor Jacob Wyss

Jacob Wyss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat management and removal assemblies for semiconductor devices
    Patent number: 9693487
    Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: June 27, 2017
    Assignee: Caterpillar Inc.
    Inventors: Edward Choi, Chris J. Scolton, Jacob Wyss
  • Heat Management and Removal Assemblies for Semiconductor Devices
    Publication number: 20160234967
    Abstract: This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.
    Type: Application
    Filed: February 6, 2015
    Publication date: August 11, 2016
    Applicant: Caterpillar Inc.
    Inventors: Edward Choi, Chris J. Scolton, Jacob Wyss