Patents by Inventor Jacobus Cornelius Doesburg

Jacobus Cornelius Doesburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrodeposition process and a layered composite material produced thereby
    Patent number: 6797409
    Abstract: An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au5Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 28, 2004
    Assignee: The Governors of the University of Alberta
    Inventors: Douglas G. Ivey, Barbara M. Djurfors, Jacobus Cornelius Doesburg
  • Electrodeposition process and a layered composite material produced thereby
    Publication number: 20030134142
    Abstract: An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au5Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.
    Type: Application
    Filed: December 21, 2001
    Publication date: July 17, 2003
    Applicant: The Governors of the University of Alberta
    Inventors: Douglas G. Ivey, Barbara M. Djurfors, Jacobus Cornelius Doesburg