Patents by Inventor Jacov Brener

Jacov Brener has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array pattern for an integrated circuit
    Patent number: 11640933
    Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: May 2, 2023
    Assignee: Mellanox Technologies, Ltd.
    Inventors: Pavel Vilner, Dmitry Fliter, Jacov Brener
  • BALL GRID ARRAY PATTERN FOR AN INTEGRATED CIRCUIT
    Publication number: 20220293500
    Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 15, 2022
    Inventors: Pavel Vilner, Dmitry Fliter, Jacov Brener