Abstract: A heat sinking apparatus that dissipates heat generated by a surface mountable power device, which can be auto picked and placed, comprises a first planar surface, at least one gull wing mounting tab, and at least one connective leg. The at least one connective leg thermally couples the first planar surface to the gull wing tab and all three structures are comprised of a thermally conductive material. When the heat sinking apparatus is coupled to a substrate, heat generated by the surface mountable power device is thermally transferred through a thermal plane of the substrate to the heat sinking apparatus.

Abstract: A carrier/insertion apparatus that has a U channel handle is improved to comprise an insertion portion, a stabilizer plate, and a deflector portion. The substrate that the carrier/insertion apparatus is mounted on comprises a carrier/insertion apparatus interface region that allows the carrier/insertion apparatus to mate thereto. As the carrier/insertion apparatus is slid into place, the deflector portion deflects the substrate a predetermined distance such that the carrier/insertion apparatus can be snapped into place. This arrangement allows for the carrier/insertion apparatus to be mounted on to a substrate without the use of mechanical hardware.