Patents by Inventor Jacques Boissel

Jacques Boissel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contact for an electrical connector protected by a polymer film and its production process
    Patent number: 5350323
    Abstract: The invention relates to a contact for an electrical contactor protected by a polymer film and to its production process.This contact (3 or 7) has a contact resistance of at the most 10 ohms and incorporates a base metal coated by a 5 to 500 nm, homogeneous, adhesive organic polymer film. The polymer film can be deposited by the electropolymerization of a monomer such as acrylonitrile, followed by a heat treatment or irradiation to improve its electrical conductivity, so that a contact resistance not exceeding 10 ohms is obtained.
    Type: Grant
    Filed: June 3, 1993
    Date of Patent: September 27, 1994
    Assignees: Commissariat a l'Energie Atomique, Souriau et Cie
    Inventors: Jacques Boissel, Joseph Delhalle, Gerard LeCayon, Pascal Viel
  • Process for polymerization of vinyl chloride micro-suspension with metal compounds
    Patent number: 4091197
    Abstract: Micro-suspension polymerization of vinyl chloride monomers and comonomers with a seed in the form of a previously prepared dispersion of the polymer or copolymer containing all of the organo-soluble initiator required for the polymerization, in which the initiator is activated during the polymerization by the addition of an organo-metallic complex of a water-soluble metal salt reacted with a complexing agent.
    Type: Grant
    Filed: December 5, 1975
    Date of Patent: May 23, 1978
    Inventors: Nicolas Fischer, Jacques Boissel, Thomas Kemp, Henri Eyer