Abstract: The invention relates to a photocoupler for surface mounting. The device includes a first support (20), a phototransmitter element, a second support (20') having a photoreceiver element, and an electrically insulating assembly housing (1) in which the first and the second supports (20, 20') are assembled together by snap connections (11, 12) in a longitudinal direction of the assembly housing in such a way that the phototransmitter element and the photoreceiver element face on another. The first and the second support (20, 20') have a lateral surface (26) provided with conductor tracks (22, 24) in electrical contact with the said respective elements to enable surface mounting.

Abstract: The method comprises an operation for the centering of the end of an optical fibre (8) with respect to an optical element which comprises an opto-electronic component (3). To this end, a magnetizable ring (7) is secured on the surface of a bottom plate (1) which is connected to the optical element, said ring being attracted, under the influence of a magnetic field, against a ferromagnetic bush (9) which is secured to the end of the fibre (8), said ring thus being positioned so that the light transmission efficiency is optimum and being retained in this position, after which the assembly is provided with an opaque plastics envelope.

Abstract: The invention relates to an optoelectronic component for surface mounting of the type having an opto-electronic element arranged on the bottom of a cavity provided in a support and to the method of manufacturing same. The component includes a cavity coated with a metallization coating. The optoelectronic element is soldered on the bottom of the cavity. The support is a substrate of Si strongly doped with the first conductivity type, whose surfaces are orientated according to the plane (100), while the metallized surfaces of the cavity are formed by the preferential attack according to the planes (111). Regions of the second conductivity type are diffused into the cavity and into a cavity merging into the latter from the lower surface of the substrate. The element is soldered with suitable polarity, and insulation is provided by a diode connected with reverse polarity in parallel with its terminals. The contact points at the lower surface of the substrate permit surface mounting.

Abstract: An electrically insulating substrate has an array of holes formed in it for accepting electrically conducting support pins, each pin having a light-emitting element mounted on the upper pin end. Each upper pin end is surrounded by an insulating ring and a conducting ring, the light emitting element being connected electrically between the conducting pin and the conducting ring. Electrical connections are made via a printed wiring pattern on each surface of the substrate. Optical collimating elements are formed in a wafer having openings that surround each of the conducting rings with a small clearance, the wafer engaging and being insulated from the substrate with the printed wiring.

Abstract: The invention relates to an optoelectronic device for surface mounting of the type comprising an insulating substrate, whose upper surface receives at least one optoelectronic element electrically connected to contacts of the lower surface of the substrate through conductive strips. An annular spacer is fixed to the upper surface of the substrate. A spherical lens is glued on the annular spacer and the plane of light emission is situated at a distance from the spherical lens which is smaller than its extension.

Abstract: A method of manufacturing a terminal device by the steps of locking an afocal system, which is formed by a ball lens and an opto-electronic element, to the bottom of a housing, and centering central aperture of a diaphragm with respect to the ball lens. Subsequently, using a mechanical guiding operation by means of a pin, the micro-component thus formed is positioned with respect to a reference surface of a base. The terminal device thus obtained is capable of receiving an optical fiber in its central aperture without further alignment being required.

Abstract: A method of coupling an optical fiber (6) and an optoelectronic component which is formed in a semiconductor body whose surface is provided with metallic contact pads. The pads are connected, via connection wires, to external metallic layers on a support. In the method one end of the optical fiber is guided between beads formed on the surfaces of the contact pads and rests on these pads.

Abstract: A display panel comprises a plurality of semiconductor crystals (6) fixed at the bottom of reflecting cavities (3).The cavities (3) are obtained from strips supporting two rows of complementary half-shells (1, 2) and supporting the connection means of the semiconductor crystals (6).

Abstract: An electroluminescent device is provided with two semiconductor crystals, in each of which an electroluminescent junction is formed, which junctions can alternately be energized from an external current source. One of the semiconductor crystals is of the p/n-type and the other semiconductor crystal is of the n/p-type, while both crystals are provided on the bottom of a reflecting cavity of a single metal support.

Abstract: Display device comprising several electroluminescent semiconductor crystals 12 provided on a base 10 and which furthermore comprises a block 13 with apertures 14 which form light conductors and a filter 16 on the upper side, the base and the block being manufactured from the same thermoplastic material, internal electric connections consisting of layers of conductive thermosetting resin.Apparatus using display devices.

Abstract: Disclosed is a method of manufacturing coplanar photocouplers comprised of a photo-conductor of transparent plastic material covered with a metal mirrors in which a mosaic of recesses is formed in a sheet of deformable metal by deep drawing and the recesses are then filled with plastic in a liquid form. After curing of the plastic the optical elements thus formed are separated from each other.

Abstract: Display device for alphanumeric characters manufactured from a block having cavities at the bottom of which electroluminescent diodes are provided. The block is obtained from a plastic material and the cavities are filled with a transparent resin, said plastic material and said resin belonging to groups of materials which cannot adhere together.

Abstract: A photocoupler device with an insulating element comprising a shield situated perpendicularly to the optical axis of a light emitter and a receiver. The shield comprises a thermoplastic transparent material.