Abstract: Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.

Abstract: The invention relates to an optical navigation device based on production on wafer scale, in which both the illumination path and the imaging lens system are integrated on a common carrier structure. The optical navigation devices according to the invention are used for controlling a cursor on an image output device or in the field of finger navigation.

Abstract: The invention relates to the development of economical camera modules having objectives contained therein with a minimal constructional length and excellent optical properties. It is made possible as a result that camera modules of this type can be used in mobile telephones or minicomputers, such as PDAs (personal digital assistant).

Abstract: A process and method for fabricating a master lens array for use in the manufacture of duplicate lens arrays is provided. The fabrication methods provided herein are capable of maximizing the quality of the master lens array in an efficient and cost effective manner, thereby reducing the propagation of errors in the lenses formed using the master lens array.

Abstract: An optical device for imaging is disclosed having at least one micro lens field with at least two micro lenses and one image sensor with at least two image detector matrices. The at least two image detector matrices each include a plurality of image detectors and there is an allocation between the image detector matrices and the micro lenses, so that each micro lens together with an image detector matrix forms an optical channel. The center points of the image detector matrices are shifted laterally by different distances, with respect to centroids, projected onto the image detector matrices, of the micro lens apertures of the associated optical channels, so that the optical channels have different partially overlapping detection areas and so that an overlapping area of the detection areas of two channels is imaged onto the image detector matrices offset with respect to an image detector raster of the image detector matrices. Further, an image processing device and a method for optical imaging are described.

Abstract: A device for optical navigation, containing an image sensor which has a large number of image sensor units which are disposed in an array-like manner with respectively at least one light-sensitive surface and at least one lens which is disposed between an object to be imaged and the image sensor. A microlens array is present, at least one microlens being assigned to one image sensor unit.

Abstract: Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. Lens stack arrays in accordance with many embodiments of the invention include lens elements formed on substrates separated by spacers, where the lens elements, substrates and spacers are configured to form a plurality of optical channels, at least one aperture located within each optical channel, at least one spectral filter located within each optical channel, where each spectral filter is configured to pass a specific spectral band of light, and light blocking materials located within the lens stack array to optically isolate the optical channels.

Abstract: Systems and methods for implementing array cameras configured to perform super-resolution processing to generate higher resolution super-resolved images using a plurality of captured images and lens stack arrays that can be utilized in array cameras are disclosed. An imaging device in accordance with one embodiment of the invention includes at least one imager array, and each imager in the array comprises a plurality of light sensing elements and a lens stack including at least one lens surface, where the lens stack is configured to form an image on the light sensing elements, control circuitry configured to capture images formed on the light sensing elements of each of the imagers, and a super-resolution processing module configured to generate at least one higher resolution super-resolved image using a plurality of the captured images.

Abstract: Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure.

Abstract: Accurate lens substrates on a waferscale are obtained by forming a polymer material on a lens surface formed on a lens wafer. The substrate may also be thinned by the glass lens surface forming process at the portion of the lens. The polymer material may have the same or different optical properties (refractive index and dispersion) as the lens wafer.

Abstract: Methods and apparatus to correct a curved Petzval focusing surface to a plane using a convex lens, a concave lens, and a space arranged between the curved side of the convex lens and the curved side of the concave lens. The method and apparatus may also include a Fresnel lens arranged between the concave lens and a pixel array.

Abstract: According to the invention, the image detection system contains optical channels arranged one next to the other with a respectively assigned microlens with aperture and in each case at least one detector located in the image plane, wherein the detectors are arranged such that the directions of the optical axes, which form in each case the connecting lines between lens apices and centre of the detectors, represent a function of the position of the respective optical channel, wherein at least one aperture stop arrangement (4) is provided between the microlenses (1?) with aperture (2?) and the detectors (6?, 8), wherein the distance between centres of the aperture stops (4?) is located between the distance between apices of the microlenses (1?) and distance between centres of the detectors (6?, 8) such that, depending on the position of the channels, the aperture stops (4?) are arranged with different offsets to the microlenses (1?) and the detectors (6?, 8) and are in each case located on a straight line with t

Abstract: The invention relates to a microlens array with integrated illumination, an imaging system with such a microlens array, an image detection device and also a method for producing the microlens array.

Abstract: Lens structures, imaging devices, and methods of making the same that include a lens and a transparent material having different dispersions and used to correct chromatic and spherical aberrations. The transparent material may be a curable polymer used to join the lens to other elements of the lens structure.

Abstract: Image sensor having a large number of image sensor units in an essentially array-like arrangement, the light-sensitive surfaces of the image sensor units being node points at a spacing relative to each other and these, together with the horizontal and vertical connection lines which connect the node points, spanning a two-dimensional network, and the array-like arrangement having a central region and an edge region, the central region and the edge region being connected to each other along at least connection line, characterised in that the spacing respectively of two adjacent node points of the array-like arrangement is different along the at least one connection line in the central region and in the edge region. Furthermore, a camera system with an image sensor according to the invention and an additionally disposed lens system is disclosed.

Abstract: Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.

Abstract: Lens structures, imaging devices, and methods of making the same that include a lens and a transparent material having different dispersions and used to correct chromatic and spherical aberrations. The transparent material may be a curable polymer used to join the lens to other elements of the lens structure.

Abstract: Camera modules are provided using wafer level optics structures. Wafers of optical stack components such as spacers, lenses, filters, and aperture layers may be combined to form optical stacks for camera modules. Each optical stack may be formed from pieces of the lens and spacer wafers. The optical stacks may be mounted above digital image sensors to form compact camera modules for devices such as cellular telephones and digital cameras. To reduce lens flare, a lens hood structure may be mounted above the outermost lens in the optical stack structure. The lens hood structure may be formed from a layer of opaque plastic having an inner surface and an outer surface. The layer of plastic may be provided as part of a camera module housing or as a separate structure. A noncircular lens hood aperture may be formed in the outer surface of the lens hood layer. A corresponding inner aperture may be formed in the inner surface of the lens hood layer adjacent to the optical stack structure.

Abstract: A method and apparatus used for forming a lens and spacer combination, and imager module employing the spacer and lens combination. The apparatus includes a mold having a base, spacer section, and mold feature. The method includes using the mold with a blank to create a spacer that includes an integral lens. The spacer and lens combination and imager modules can be formed on a wafer level.

Abstract: A lens system comprising an inner lens structure and an outer lens structure. The inner lens structure comprises an inner positive lens, a first transparent substrate and an inner negative lens. The outer lens structure comprises an outer positive lens, a second transparent substrate and an outer negative lens.