Abstract: A unidirectional acoustic probe including a high-performance interconnection network, and a method of manufacturing such a probe. The unidirectional acoustic probe includes linear piezoelectric transducers on the surface of a dielectric film. The dielectric film includes a connection device to electrically connect the piezoelectric transducers to a control device. The connection device includes primary connection pads, facing the piezoelectric transducers, secondary connection pads, offset with respect to the piezoelectric transducers, so that the transducers can be connected to the control device, and conducting tracks connecting the primary connection pads to the secondary connection pads. The conducting tracks are in a direction perpendicular to the direction defined by a major axis of the piezoelectric transducers.

Abstract: The invention relates to a unidirectional acoustic probe comprising a high-performance interconnection network, and a method of manufacturing such a probe.

Abstract: A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.

Abstract: When making curved bar probes it is necessary, particularly at high frequency, to provide circuits for the connection of piezoelectric elements of the bars which are compatible with the curvature imposed to the bar after it has been fabricated flat. The invention overcomes such difficulty by adjoining on both sides of the elements a generally parallelepipedic relay metallized on at least two (12,13) of its adjacent faces to transpose one connection face (7) situated in plane which must be curved into one connection face (13) which is perpendicular and of which the orientation remains unchanged and parallel to a same plane during the curvature operation. As a result, the connection is simplified.