Patents by Inventor Jacques Lantaires

Jacques Lantaires has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating semiconductor components using temporary substrates
    Patent number: 4530152
    Abstract: In the manufacture of a semiconductor component, connection areas adapted to connect the component externally are formed by a metal array (3, 4) deposited on a conductive layer (6) of low melting point alloy, itself deposited on a metal temporary substrate (7). Each component chip (1) is placed in position and connected and then immobilized by means of a hardenable resin (5). The temporary substrate (7) is then removed by melting the alloy layer (6) to expose the surfaces of the connection areas (3, 4) for making external electrical and/or thermal connections to the encapsulated component.
    Type: Grant
    Filed: April 1, 1983
    Date of Patent: July 23, 1985
    Assignee: Compagnie Industrielle des Telecommunications CIT-ALCATEL
    Inventors: Georges Roche, Jacques Lantaires