Abstract: A tool for testing the miniaturized circuitry of silicone wafer devices. A ring-shaped structure is supported on a casting or platform for movement along X and Z axes in a horizontal plane. A probe is suspended from the ring-shaped element for contact with a lead-in point of the circuitry on the device to be tested. The probe may be moved along the X and Z horizontal axes and a Y vertical axis relative to the ring, movement in the X and Z axes being controlled by a single lever which acts between the ring and the probe. Movement of the probe in the Y axis is controlled by a screw-type pressure-exerting device which also serves as a pivot point for movement of the probe along the horizontal axes. A high performance board is supported on the ring to act as a junction board so that the probes may be connected to a cable which runs around the ring. The cable extends radially therefrom at a location such that it may be connected to suitable external control circuitry.

Abstract: A probe for testing integrated circuit components which includes a dielectric support body, conductive arms supported by the body and with the arms including a longer arm and a shorter arm. The shorter arm is positioned above the longer arm in spaced relation thereto with each arm having an outer end connected to a conductive probe tip. The probe tip includes a downwardly positioned point for contact with a surface having an integrated circuit defined thereon and contact means are provided which cooperate with the arms and tip to transmit an electrical signal to the tip or receive a signal from the tip.

Abstract: A probe for testing integrated circuit components which includes a dielectric support body, conductive arms supported by the body and with the arms including a longer arm and a shorter arm. The shorter arm is positioned above the longer arm in spaced relation thereto with each arm having an outer end connected to a conductive probe tip. The probe tip includes a downwardly positioned point for contact with a surface having an integrated circuit defined thereon and contact means are provided which cooperate with the arms and tip to transmit an electrical signal to the tip or receive a signal from the tip. The probe tip includes a thin-walled bent tube that is secured to the probe. The bend in the thin-walled tube serves to frictionally hold a needle in the thin-walled tube because on insertion of a needle the tube will be resiliently straightened to create a frictional force between the tube and the needle.

Abstract: Testing of integrated circuit components of the silicon wafer type is accomplished by a test probe assembly mounted on a support table, the latter being spaced vertically with respect to a platform on which the circuit components are placed. The test probe assembly, which includes a probe test unit, is mounted on the support in such a fashion that the test probe may be moved to a precise predetermined position corresponding to the precise location of that portion of the integrated circuit to be tested. This is accomplished by mounting the assembly housing such that it moves arcuately with respect to its support structure, while providing a slide unit within the housing which is movable vertically as well as axially with respect to the housing. Once the proper predetermined position has been determined and the test probe assembly adjusted such that the probe is properly aligned with the particular portion of the integrated circuit to be tested, the entire assembly is maintained in proper position.