Abstract: The specification discloses a process for cationic polymerization of vinyl aromatic monomers, adhesive compositions containing polymers made by the process and use of the polymers as processing aids for thermoplastic polymers. In the process, a vinyl aromatic monomer is dissolved in an organic solvent containing a complex comprising an in situ formed ester of an unsaturated carboxylic acid and a Lewis acid to provide a polymer having a softening point above about 125.degree. C. and a polydispersity index above about 2.0. Surprisingly, the Lewis acid/acrylate complex causes the reaction to proceed with reduced exothermicity and enables an increase in the softening point and yield as compared with a polymer made without the complex or using other complexes.

Abstract: The present invention relates to a resinous copolymer comprising monomer units of each of the groups of phenol compounds (I) and olefinically unsaturated non-acid terpene compounds (II), characterized in that the copolymer contains monomer units from the group of polyunsaturated olefin compounds (III), the monomer units of compound (III) being 1 to 70% by weight of the total of the monomer units of compounds (II) and (III), the monomer units of compounds (II) and (III) being at least 50% by weight of the total of monomer units of compounds (I), (II) and (III). The melting point of the copolymer is at least 130.degree. C. The copolymers are particularly useful in printing ink formulations.

Abstract: The present invention relates to a resinous copolymer comprising monomer units of each of the groups of phenol compounds (I) and olefinically unsaturated non-acidic terpene compounds (II), characterized in that the copolymer contains monomer units from the group of polyunsaturated olefin compound (III), the monomer units of compound (III) being 1 to 70% by weight of the total of the monomer units of compounds (II) and (III), the monomer units of compounds (II) and (III) being at least 50% by weight of the total of the monomer units of compounds (I), (II) and (III). The melting point of the copolymer is at least 130.degree. C.The copolymers can be used in printink inks.

Abstract: A resinous copolymer composition essentially made up of a vinyl-aromatic monomer and at least one other hydrocarbon having a copolymerizable unsaturation, optionally together with one or more further copolymerizable compounds selected from the group comprising substituted benzene compounds, unsaturated carboxylic acid compounds and conjugated dienic compounds. This copolymer composition comprises at least 5% by weight of paramethylstyrene units, in a proportion at least equal to any amount of metamethylstyrene present in said copolymer composition and a resinous copolymer composition comprising at least 40% by weight of paramethylstyrene together with at least one other hydrocarbon monomer having a copolymerizable unsaturation, and optionally one or more further copolymerizable compounds selected from the group comprising substituted benzene compounds, unsaturated carboxylic acid compounds, and conjugated dienic compounds.

Abstract: Solid copolymer tackifying resins based on dicyclopentadiene, a vinylaromatic hydrocarbon and a benzene carrying 1 to 3 lower alkyl, hydroxyl or halogen substituents and adhesive formulations containing these resins.

Abstract: Resins suitable for adhesives are based on .alpha.-methyl styrene, styrene and phenol in certain percentages, viz. 25 to 63, 35 to 73 and 2 to 15 percent by weight, respectively,Combinations of resin, ethylene vinyl acetate copolymer or thermoelastomer and optionally a wax or tackifying oil yield excellent adhesives, in particular hot-melt adhesives.