Patents by Inventor Jacques Tanniou

Jacques Tanniou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular assembly including two electronic circuits to be electrically interconnected to convey a microwave signal
    Patent number: 5808530
    Abstract: The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: September 15, 1998
    Assignee: France Telecom
    Inventors: Ndiata Kalonji, Jack Semo, Jacques Tanniou