Abstract: A soldering mask for soldering the leads of leaded components to a circuit pattern on a surface of a circuit board also having surface mounted components already soldered to the circuit pattern on that surface, comprises a flat metal plate having a recess in the top surface of the plate for reception of the circuit board. Cavities in the bottom surface of the recess house the surface mounted components. Openings through the plate from the bottom surface of the recess permit passage of leads and also permit access by the solder to solder the leads to the circuit pattern.

Abstract: Solder pads for surface mounting of devices on a circuit board are given predetermined shapes. By shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on melting of the solder at the pad. Improved alignment and positioning is obtained. Broadly, a contact or solder pad comprises a rectangular portion and a segmental portion, the device end resting on the rectangular portion and the segmental portion being outside of the contact position.

Abstract: A solder pad is provided at each end of a mounting position for a cylindrical electronic device on a circuit board. Each solder pad has two humps of solder spaced apart in a direction normal to the axis of the device, the humps defining a channel in which the end of a device can rest prior to being reflow soldered. The humps have a convex arcuate outer surface in plan view and when viewed in a direction parallel to the axis of the device has a profile which is of convex arcuate form. The humps are formed by depositing a thick patch of solder paste at each hump position and heating the circuit board and solder paste to melt the paste. After positioning of devices, the solder is reflowed to attach the devices.