Abstract: A method of manufacturing a plurality of multilayer electronic components, comprises the steps of:(a) Manufacturing a laminated sheet (1) in which layers of ceramic tape are each provided on one side with a pattern of electrodes; are stacked so that the electrode patterns on consecutive layers are offset back and forth with respect to one another, and are pressed together, cutting the laminated sheet into segments in which consecutive electrodes with a gas cooled laser beam, are alternately exposed at a different segment edge with a gas cooled laser beam; sintering the segments and providing electrical contacts which interconnect the electrodes exposed at given segment edges.

Abstract: A method of manufacturing a multilayer ceramic electronic component which comprises alternately conductive layers and dielectric layers, and in which successive, conductive layers are made alternately from two different electrode materials and extend up to the surfaces of all four side faces of the substrate, in which method, an end face of the stack of layers is immersed in an electrolytic solution and the least noble electrode material of the two electrode materials is electrochemically dissolved out, the resultant cavities are filled with a curable monomer, the noblest one of the two electrode materials is exposed by removing the polymeryzate formed, and a potential is applied to said electrode material, which is so high as to enable said noble electrode material at the other end face of the stack to be electrochemically dissolved out, the resultant cavities at the other end face are filled with a curable monomer, and outer electrodes are provided on opposite sides of the stack.

Abstract: The invention relates to a multilayer film, in particular for the films for the manufacture of passive electronic components, the multilayer film having a small and uniform layer thickness, an improved layer structure and the method of manufacturing said films being simpler. In accordance with the invention, a multilayer film is proposed which comprises a green ceramic substrate film, inner electrodes provided by screen printing and one or more levelling layers which are provided on the whole area accommodating the green ceramic substrate film and the inner electrodes by means of screen printing. The inner electrodes and the levelling layer(s) are successively provided on the green ceramic substrate film by screen printing.

Abstract: Method of depositing microcrystalline solid bodies from the gas phase by means of Chemical Vapor Deposition (CVD) in which the solid particles are deposited on a substrate heated to a temperature ranging between 450.degree. and 1200.degree. C. at a pressure ranging between 10.sup.-5 and 1 bar and at a directed gas flow, in which method the reactant gas is passed through a porous intermediate body having a thickness of between 2 and 30 mm of a material suitable for use at temperatures up to 2500.degree. C., which intermediate body is present in the zone having the maximum energy content within the reactor, while the reactant gas is excited in said intermediate body, whereafter the solid particles are deposited on the substrate.