Patents by Inventor Jadhav G. Susheel

Jadhav G. Susheel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for attaching a semiconductor die to a heat spreader
    Patent number: 7407085
    Abstract: Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: August 5, 2008
    Assignee: Intel Corporation
    Inventors: Jadhav G. Susheel, Daoqiang Lu