Patents by Inventor Jadish G. Belani

Jadish G. Belani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-cost semiconductor device package process
    Patent number: 4908086
    Abstract: An adhesive composition for attaching semiconductor die to a substate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane cross-linking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.
    Type: Grant
    Filed: June 24, 1985
    Date of Patent: March 13, 1990
    Assignee: National Semiconductor Corporation
    Inventors: Gary B. Goodrich, Jadish G. Belani
  • Low-cost semiconductor device package and process
    Patent number: 4535350
    Abstract: An adhesive composition for attaching semiconductor die to a substrate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane crosslinking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.
    Type: Grant
    Filed: June 29, 1984
    Date of Patent: August 13, 1985
    Assignee: National Semiconductor Corporation
    Inventors: Gary B. Goodrich, Jadish G. Belani
  • High temperature stable adhesive for semiconductor device packages, low-cost semiconductor device package and process
    Patent number: 4518735
    Abstract: An adhesive composition for attaching semiconductor die to a substrate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane crosslinking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.
    Type: Grant
    Filed: October 29, 1981
    Date of Patent: May 21, 1985
    Assignee: National Semiconductor Corporation
    Inventors: Gary B. Goodrich, Jadish G. Belani