Patents by Inventor Jae Boem MUN

Jae Boem MUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NEUTRON SHIELDING PACKING BODY FOR AIR TRANSPORTATION OF SEMICONDUCTOR DEVICE
    Publication number: 20190221525
    Abstract: A neutron shielding packing body configured to pack a semiconductor device is disclosed. The neutron shielding packing body reduces Total Ionizing Dose (TID) defects caused in the semiconductor device by collisions with neutrons during air transportation of the semiconductor device. The neutron shielding packing body includes hydrogen and boron.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 18, 2019
    Applicant: SK hynix Inc.
    Inventors: Kun Young LEE, Sang Jun LIM, Ha Ni KIM, Hyun Woo KIM, Jae Boem MUN, Sang Kil LEE