Patents by Inventor Jae-Boong Cho

Jae-Boong Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of interconnecting layers of a printed circuit board
    Publication number: 20090083975
    Abstract: A method of interconnecting layers of a printed circuit board is disclosed. The method includes: forming at least one bump on a first metal layer using a conductive paste containing carbon nanotubes, stacking an insulation layer on the first metal layer such that the bumps penetrate the insulation layer, and stacking a second metal layer on the insulation layer such that the second metal layer is electrically connected with the first metal layer by the bump.
    Type: Application
    Filed: April 8, 2008
    Publication date: April 2, 2009
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION
    Inventors: Eung-Suek Lee, Young-Jin Kim, Seung-Hyun Baik, Jae-Boong Cho, Young-Seok Oh, Dae-Woo Suh, Je-Gwang Yoo, Jee-Soo Mok, Chang-Sup Ryu