Patents by Inventor Jae-Bum Mo

Jae-Bum Mo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR TEST EQUIPMENT AND METHOD OF TESTING AND MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
    Publication number: 20130323864
    Abstract: A method of manufacturing a semiconductor device including a substrate is disclosed. The method includes: providing the substrate on a wafer chuck; positioning a probe card having probe needles above the substrate; positioning a tester head above the probe card; using a sensor included in the tester head, measuring a deformation of the probe card; using a variable load device included in the tester head, adjusting the deformation of the probe card based on the measured deformation; and testing the substrate using the adjusted probe card.
    Type: Application
    Filed: February 7, 2013
    Publication date: December 5, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Bum Mo, Byoung-Joo Kim, Jin-Su Kim