Abstract: This invention relates to a method of manufacturing a MOSFET with LDD regions, high integrated semiconductor, wherein a photoresist pattern for a source/drain implant mask is formed to sufficiently cover the part where the edge between field oxide layer and LDD regions are crossed. As a result, at the place damaged from the formation of spacer at the side wall of gate electrode, high concentrated impurity should not be implanted so as to form the source/drain region within LDD regions. Consequently, this invention prevents the weakening of breakdown voltage or increase of leakage current.

Abstract: A dynamic random access memory device having a SDT cell structure and a dynamic random access memory device having a SDTSAC cell structure together with methods for manufacturing each cell structure are disclosed.

Abstract: A DRAM cell having a SDTAS structure having a trench stacked capacitor which includes a capacitor charge storage electrode which is in physical contact and is electrically connected to a N+ drain region, and a VCC/2 electrode which is electrically isolated by an ONO layer formed between the capacitor charge storage electrode and the VCC/2 electrode is disclosed. Such cell can increase the capacitance of the capacitor and reduce the area of the cell by reducing the width of the MOSFET, and a method for manufacturing such cell.