Patents by Inventor Jae Chel SUNG

Jae Chel SUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same
    Patent number: 12134162
    Abstract: The present invention provides a method for manufacturing a wafer polishing head, the method comprising the steps of: coupling a guide ring consisting of a plurality of layers to the edge of a base substrate; rounding the edge of the guide ring; forming a first coating layer on the rounded surface of the guide ring through coating; fixing a rubber chuck to the base substrate; and forming a second coating layer on the outer circumferential surfaces of an adhesive and an adhesive material through coating, from the rubber chuck to the first coating layer.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: November 5, 2024
    Assignee: SK SILTRON CO., LTD.
    Inventor: Jae Chel Sung
  • WAFER POLISHING HEAD, METHOD FOR MANUFACTURING WAFER POLISHING HEAD, AND WAFER POLISHING APPARATUS COMPRISING SAME
    Publication number: 20220379429
    Abstract: The present invention provides a method for manufacturing a wafer polishing head, the method comprising the steps of: coupling a guide ring consisting of a plurality of layers to the edge of a base substrate; rounding the edge of the guide ring; forming a first coating layer on the rounded surface of the guide ring through coating; fixing a rubber chuck to the base substrate; and forming a second coating layer on the outer circumferential surfaces of an adhesive and an adhesive material through coating, from the rubber chuck to the first coating layer.
    Type: Application
    Filed: October 23, 2019
    Publication date: December 1, 2022
    Inventor: Jae Chel SUNG
  • Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same
    Patent number: 8574033
    Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: November 5, 2013
    Assignee: LG Siltron Inc.
    Inventor: Jae Chel Sung
  • WAFER SUPPORT MEMBER, METHOD FOR MANUFACTURING THE SAME AND WAFER POLISHING UNIT COMPRISING THE SAME
    Publication number: 20110081841
    Abstract: Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
    Type: Application
    Filed: October 6, 2010
    Publication date: April 7, 2011
    Inventor: Jae Chel SUNG