Abstract: A water sterilization module includes a container including a water inlet and a water outlet and containing water therein, and a light source part mounted on a part of the container and irradiating sterilizing light into the container. The water inlet has a diameter larger than a diameter of the water outlet.

Abstract: There is provided a power supply device having a primary side on which a primary winding of a transformer is located and a secondary side on which a secondary winding of the transformer is located, and supplying power to a load, the device including: a photo coupler transmitting load short-circuit information from the secondary side to the primary side, a standby power supply terminal supplying power to the photo coupler; and a current passing unit connecting the photo coupler to the load.

Abstract: There is provided a power supply device having a primary side on which a primary winding of a transformer is located and a secondary side on which a secondary winding of the transformer is located, and supplying power to a load, the device including: a photo coupler transmitting load short-circuit information from the secondary side to the primary side, a standby power supply terminal supplying power to the photo coupler; and a current passing unit connecting the photo coupler to the load.

Abstract: The power supply includes: an electromagnetic interference filter including a first filter which has a pair of electromagnetically coupled cores having at least two leg parts, first and second bobbins each having a tube-shaped body part having a penetration hole into which each of the leg parts is inserted and having a winding region defined as the circumference of the outer peripheral surface of the body part, and first and second coils respectively wound around the first and second bobbins to remove common mode electromagnetic interference included in power transmitted from a power line, the electromagnetic interference filter removing differential mode electromagnetic interference due to leakage inductance formed due to the leakage of magnetic flux flowing through the cores; a power factor corrector correcting a power factor of the power where the electromagnetic interference is removed; and a power converter switching the power-factor-corrected power into a driving power having a predetermined voltage lev

Abstract: Provided is a choke coil including: a first primary winding portion formed by winding a primary coil by n turns; a second primary winding portion formed by winding the primary coil by N turns; a first secondary winding portion formed by winding a secondary coil by N turns; and a second secondary winding portion formed by winding the secondary coil by n turns, wherein the n and N satisfy the condition: n?N.

Abstract: The power supply includes: an electromagnetic interference filter including a first filter which has a pair of electromagnetically coupled cores having at least two leg parts, first and second bobbins each having a tube-shaped body part having a penetration hole into which each of the leg parts is inserted and having a winding region defined as the circumference of the outer peripheral surface of the body part, and first and second coils respectively wound around the first and second bobbins to remove common mode electromagnetic interference included in power transmitted from a power line, the electromagnetic interference filter removing differential mode electromagnetic interference due to leakage inductance formed due to the leakage of magnetic flux flowing through the cores; a power factor corrector correcting a power factor of the power where the electromagnetic interference is removed; and a power converter switching the power-factor-corrected power into a driving power having a predetermined voltage lev

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages.

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract: Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages.

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages.

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages.