Patents by Inventor Jae-cheol Kim

Jae-cheol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12130010
    Abstract: Proposed is a connection tube support of a waste heat recovery boiler supporting a connection tube unit having a plurality of connection tubes that is disposed inside a waste heat recovery boiler and perform heat exchange between a fluid flowing inside and exhaust gas flowing outside, wherein the connection tube support includes a header storing fluid flowing through the connection tube unit and supporting one end of the connection tube unit by being connected to one end of the connection tube unit, and a tube sheet supporting a circumferential surface of each of the plurality of connection tubes, wherein the tube sheet has the plurality of connection tubes having been passed therethrough and is provided with a plurality of support holes respectively supporting circumferential surfaces of the plurality of connection tubes having been passed therethrough.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: October 29, 2024
    Assignee: DOOSANENERBILITY CO., LTD.
    Inventors: Uk Kim, Jae Cheol Kim, Min Su Kim, Jung Ah Son, Young Wook Lee, Jong Ho Hong, Kyu Man Kim
  • Patent number: 12104860
    Abstract: Disclosed herein is a once-through heat exchanger that includes a tube stack including a plurality of tubes, a plurality of heads connected to the tubes and configured to accommodate heated steam, and a manifold connected to the heads via a first link pipe and a second link pipe and configured to accommodate heated steam. The heads are spaced in a direction crossing a longitudinal direction thereof, and the first link pipe and the second link pipe include a first inclined link part or a second inclined link part, respectively, extending at an angle to each other.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: October 1, 2024
    Assignee: DOOSAN ENERBILITY CO., LTD.
    Inventors: Jae Cheol Kim, Hoon Jegal, Jong Ho Hong
  • Publication number: 20240175572
    Abstract: Proposed is a connection tube support of a waste heat recovery boiler supporting a connection tube unit having a plurality of connection tubes that is disposed inside a waste heat recovery boiler and perform heat exchange between a fluid flowing inside and exhaust gas flowing outside, wherein the connection tube support includes a header storing fluid flowing through the connection tube unit and supporting one end of the connection tube unit by being connected to one end of the connection tube unit, and a tube sheet supporting a circumferential surface of each of the plurality of connection tubes, wherein the tube sheet has the plurality of connection tubes having been passed therethrough and is provided with a plurality of support holes respectively supporting circumferential surfaces of the plurality of connection tubes having been passed therethrough.
    Type: Application
    Filed: August 4, 2023
    Publication date: May 30, 2024
    Inventors: Uk KIM, Jae Cheol KIM, Min Su KIM, Jung Ah SON, Young Wook LEE, Jong Ho HONG, Kyu Man KIM
  • Publication number: 20240159172
    Abstract: Disclosed herein is a once-through heat exchanger that includes a tube stack including a plurality of tubes, a plurality of heads connected to the tube stack via a connection module and configured to accommodate heated steam, the connector module comprising a plurality of tube connectors and configured to connect the tubes and the heads, and a manifold connected to the heads via a plurality of link pipes and configured to accommodate heated steam, wherein the connector module comprises a first tube connector and a second tube connector having different shapes.
    Type: Application
    Filed: August 17, 2023
    Publication date: May 16, 2024
    Inventors: Kyu Man KIM, Uk KIM, Jae Cheol KIM, Min Su KIM, Jung Ah SON, Young Wook LEE, Jong Ho HONG
  • Publication number: 20240159470
    Abstract: Disclosed herein is a once-through heat exchanger that includes a tube stack including a plurality of tubes, a plurality of heads connected to the tubes and configured to accommodate heated steam, and a manifold connected to the heads via a first link pipe and a second link pipe and configured to accommodate heated steam. The heads are spaced in a direction crossing a longitudinal direction thereof, and the first link pipe and the second link pipe include a first inclined link part or a second inclined link part, respectively, extending at an angle to each other.
    Type: Application
    Filed: August 29, 2023
    Publication date: May 16, 2024
    Inventors: Jae Cheol KIM, Hoon JEGAL, Jong Ho HONG
  • Patent number: 11625878
    Abstract: Provided is a method of generating a three-dimensional (3D) avatar from a two-dimensional (2D) image. The method may include obtaining a 2D image by capturing a face of a person, detecting a landmark of the face in the obtained 2D image, generating a first mesh model by modeling a 3D geometrical structure of the face based on the detected landmark, extracting face texture information from the obtained 2D image, determining a second mesh model to be blended with the first mesh model in response to a user input, wherein the first mesh model and the second mesh model have the same mesh topology, generating a 3D avatar by blending the first mesh model and the second mesh model, and applying, to the 3D avatar, a visual expression corresponding to the extracted face texture information.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: April 11, 2023
    Assignee: Seerslab, Inc.
    Inventors: Jin Wook Chong, Jae Cheol Kim, Hyo Min Kim, Jun Hwan Jang
  • Patent number: 11482505
    Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: October 25, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Cheol Kim, Gil Man Kang, Yong Dae Ha
  • Publication number: 20210005003
    Abstract: Provided is a method of generating a three-dimensional (3D) avatar from a two-dimensional (2D) image. The method may include obtaining a 2D image by capturing a face of a person, detecting a landmark of the face in the obtained 2D image, generating a first mesh model by modeling a 3D geometrical structure of the face based on the detected landmark, extracting face texture information from the obtained 2D image, determining a second mesh model to be blended with the first mesh model in response to a user input, wherein the first mesh model and the second mesh model have the same mesh topology, generating a 3D avatar by blending the first mesh model and the second mesh model, and applying, to the 3D avatar, a visual expression corresponding to the extracted face texture information.
    Type: Application
    Filed: June 29, 2020
    Publication date: January 7, 2021
    Inventors: Jin Wook CHONG, Jae Cheol KIM, Hyo Min KIM, Jun Hwan JANG
  • Patent number: 10832460
    Abstract: Disclosed is a method and apparatus for generating an image using multi-stickers. The method for generating an image according to an embodiment of the present invention comprises the steps of: displaying a subject photographed by a camera; applying the selected stickers or effects to the subject being displayed when a plurality of stickers or effects are selected among previously provided stickers or effects by a multi-sticker function; and generating an image of the subject to which the selected stickers or effects are applied, according to a photographic command.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: November 10, 2020
    Assignee: Seerslab, Inc.
    Inventors: Jae Cheol Kim, Jin Wook Chong
  • Publication number: 20200312811
    Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.
    Type: Application
    Filed: September 25, 2019
    Publication date: October 1, 2020
    Inventors: Jae-Cheol KIM, Gil Man KANG, Yong Dae HA
  • Patent number: 10692833
    Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Cheol Kim, Gil-Man Kang, Kyoung-Bok Cho, Yong-Dae Ha
  • Patent number: 10456796
    Abstract: Disclosed herein are a spray nozzle for an attemperator and an attemperator including the spray nozzle. An attemperator according to an embodiment includes: a steam transfer pipe through which steam is transferred; a fixed pipe which is fixed to an outer surface of the steam transfer pipe; and a spray nozzle, which is coupled to the fixed pipe, disposed in the steam transfer pipe and configured to spray cooling water into the steam transfer pipe. The spray nozzle includes, on an outer circumferential surface thereof, at least one support that protrudes toward the fixed pipe. The spray nozzle is spaced apart from the fixed pipe.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: October 29, 2019
    Assignee: Doosan Heavy Industries Construction Co., Ltd.
    Inventors: Dong Wook Kim, Kyu Man Kim, Woo Seong Song, Jae Cheol Kim, Cheol Hong Kim, Tae Jun Yun, Seong Yong Jeong
  • Publication number: 20190295300
    Abstract: Disclosed is a method and apparatus for generating an image using multi-stickers. The method for generating an image according to an embodiment of the present invention comprises the steps of: displaying a subject photographed by a camera; applying the selected stickers or effects to the subject being displayed when a plurality of stickers or effects are selected among previously provided stickers or effects by a multi-sticker function; and generating an image of the subject to which the selected stickers or effects are applied, according to a photographic command.
    Type: Application
    Filed: June 8, 2017
    Publication date: September 26, 2019
    Applicant: Seerslab, Inc.
    Inventors: Jae Cheol Kim, Jin Wook Chong
  • Publication number: 20190206031
    Abstract: A method and device for correcting facial contours is disclosed. The method for correcting facial contours according to one embodiment of the present invention comprises: a step of displaying a subject captured by a camera; a step of selecting, based on user input, one of a plurality of facial contours for correcting facial contours of an object included in the subject; a step of using any one selected facial contour to correct the facial contours of the object in real time, and; a step of, upon receiving a capture command through user input, generating an image of the subject, including the object having the corrected facial contours.
    Type: Application
    Filed: May 26, 2017
    Publication date: July 4, 2019
    Applicant: Seerslab, Inc.
    Inventors: Jae Cheol Kim, Jin Wook Chong
  • Patent number: 10261566
    Abstract: A remote controller and a power control method are disclosed. The remote controller includes a voice recognizer a voice recognizer configured to recognize a voice utterance, a user interface configured to receive a user command; and a controller configured to, when a user command is input through the user interface to enter a voice recognition mode, convert a stand-by mode into an active mode, and convert the active mode into the stand-by mode depending on whether the utterance is recognized within a preset critical time. Accordingly, the remote controller, enabling an operation mode of a voice recognition module which recognizes a user voice utterance to be maintained as an active mode, can reduce power unnecessarily consumed.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: April 16, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-hwan Cha, Jae-cheol Kim, Tae-je Park, Cheon-seong Lee
  • Patent number: 10038852
    Abstract: Disclosed herein are an image generation method and apparatus having a location information-based geo-sticker. The image generation method includes displaying a subject to be captured by a camera by executing a camera application on a user device, acquiring information about a location of the user device and determining whether the location of the user device based on the acquired location information is present in a predetermined area, if it is determined that the location of the user device is present in the predetermined area, receiving geo-items including at least one of a sticker and an effect corresponding to information about the predetermined area from a server; and when an image including the subject is captured using any one item included in the received geo-items, generating an image to which the one item is applied.
    Type: Grant
    Filed: October 29, 2016
    Date of Patent: July 31, 2018
    Assignee: SEERSLAB INC.
    Inventors: Jae Cheol Kim, Jin Wook Chong
  • Publication number: 20180102340
    Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.
    Type: Application
    Filed: March 20, 2017
    Publication date: April 12, 2018
    Inventors: Jae-Cheol KIM, Gil-Man KANG, Kyoung-Bok CHO, Yong-Dae HA
  • Publication number: 20170363286
    Abstract: Disclosed herein are a spray nozzle for an attemperator and an attemperator including the spray nozzle. An attemperator according to an embodiment includes: a steam transfer pipe through which steam is transferred; a fixed pipe which is fixed to an outer surface of the steam transfer pipe; and a spray nozzle, which is coupled to the fixed pipe, disposed in the steam transfer pipe and configured to spray cooling water into the steam transfer pipe. The spray nozzle includes, on an outer circumferential surface thereof, at least one support that protrudes toward the fixed pipe. The spray nozzle is spaced apart from the fixed pipe.
    Type: Application
    Filed: March 16, 2017
    Publication date: December 21, 2017
    Inventors: Dong Wook KIM, Kyu Man KIM, Woo Seong SONG, Jae Cheol KIM, Cheol Hong KIM, Tae Jun YUN, Seong Yong JEONG
  • Publication number: 20170257575
    Abstract: Disclosed herein are an image generation method and apparatus having a location information-based geo-sticker. The image generation method includes displaying a subject to be captured by a camera by executing a camera application on a user device, acquiring information about a location of the user device and determining whether the location of the user device based on the acquired location information is present in a predetermined area, if it is determined that the location of the user device is present in the predetermined area, receiving geo-items including at least one of a sticker and an effect corresponding to information about the predetermined area from a server; and when an image including the subject is captured using any one item included in the received geo-items, generating an image to which the one item is applied.
    Type: Application
    Filed: October 29, 2016
    Publication date: September 7, 2017
    Applicant: SEERSLAB, INC.
    Inventors: Jae Cheol KIM, Jin Wook CHONG
  • Publication number: 20170249971
    Abstract: Disclosed herein are a method and apparatus for generating an image in which a sound source is inserted. The method for generating an image in which a sound source is inserted includes displaying a subject, an image of which is captured using a camera, selecting a sound source, inserting the selected sound source as a background sound source of an image being captured when the image including the subject is captured, and generating an image in which the selected sound source is inserted as the background sound source.
    Type: Application
    Filed: October 29, 2016
    Publication date: August 31, 2017
    Applicant: SEERSLAB, INC.
    Inventors: Jin Wook CHONG, Jae Cheol KIM