Patents by Inventor Jae-Cheon Do

Jae-Cheon Do has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor package and method of manufacturing the same
    Patent number: 7863702
    Abstract: An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: January 4, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byoung-Rim Seo, Jae-Cheon Do, Yung-Cheol Kong, Seok-Won Lee
  • Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
    Patent number: 7494292
    Abstract: An image sensor module structure includes an image sensor package, a housing, and an underfiller. The image sensor package includes a substrate having interconnection pads formed on an outermost edge. The housing includes a filter projecting from a bottom surface of a housing body. The projecting filter is attached on an image sensor chip using various adhesive patterns. Further, the underfiller is formed in a space between the housing body and the image sensor package.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: February 24, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yung-Cheol Kong, Byoung-Rim Seo, Jae-Cheon Do
  • Image sensor package and method of manufacturing the same
    Publication number: 20060006486
    Abstract: An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
    Type: Application
    Filed: June 10, 2005
    Publication date: January 12, 2006
    Inventors: Byoung-Rim Seo, Jae-Cheon Do, Yung-Cheol Kong, Seok-Won Lee
  • Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
    Publication number: 20050285016
    Abstract: An image sensor module structure includes an image sensor package, a housing, and an underfiller. The image sensor package includes a substrate having interconnection pads formed on an outermost edge. The housing includes a filter projecting from a bottom surface of a housing body. The projecting filter is attached on an image sensor chip using various adhesive patterns. Further, the underfiller is formed in a space between the housing body and the image sensor package.
    Type: Application
    Filed: May 11, 2005
    Publication date: December 29, 2005
    Inventors: Yung-Cheol Kong, Byoung-Rim Seo, Jae-Cheon Do