Patents by Inventor Jae-Cheon Lee

Jae-Cheon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220165648
    Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 26, 2022
    Applicants: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol KIM, Yong Tae KWON, Hyo Gi JO, Dong Hoon OH, Jae Cheon LEE, Hyung Jin SHIN, Mary Maye Melgo Galimba
  • Publication number: 20220148993
    Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 12, 2022
    Applicants: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol KIM, Yong Tae KWON, Hyo Gi JO, Dong Hoon OH, Jae Cheon LEE, Hyung Jin SHIN, Mary Maye Melgo Galimba
  • Patent number: 9770177
    Abstract: The present invention relates to a ring-type cuff for blood pressure manometer, wherein the cuff (C) comprises: a circular rubber ring (1) wearable on a wrist or an ankle; a resilient coil spring (2) built-in inside the tubular rubber ring (1) in the range of length of the rubber ring to obtain a predetermined flexibility, to suppress excessive stretching, to strengthen durability, and to maintain resilience; and a measurement portion (3) comprising a pressure sensor (S) for measuring blood pressure, a transmission circuit (IC) for transmitting measurement data to the outside, a power source (v), a power switch (sw), and a pilot lamp (LED).
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: September 26, 2017
    Inventors: Byung Hoon Lee, Jae Cheon Lee
  • Publication number: 20160022158
    Abstract: The present invention relates to a ring-type cuff for blood pressure manometer, wherein the cuff (C) comprises: a circular rubber ring (1) wearable on a wrist or an ankle; a resilient coil spring (2) built-in inside the tubular rubber ring (1) in the range of length of the rubber ring to obtain a predetermined flexibility, to suppress excessive stretching, to strengthen durability, and to maintain resilience; and a measurement portion (3) comprising a pressure sensor (S) for measuring blood pressure, a transmission circuit (IC) for transmitting measurement data to the outside, a power source (v), a power switch (sw), and a pilot lamp (LED).
    Type: Application
    Filed: February 15, 2013
    Publication date: January 28, 2016
    Inventors: Byung Hoon Lee, Jae Cheon Lee
  • Publication number: 20150188179
    Abstract: A method of manufacturing an end plated for a fuel cell stack, using overmolding injection molding is provided. The method prevents damage to tapped portions in injection molding and re-tapping after the injection molding, by implementing a method of injection molding for an end plate that prevents an injection-molded part from flowing into taps by forming a male thread on a first side of each of fixing pins fitted in a metal insert in injection molding of an end plate and by fastening the fixing pins in advance in the taps of the metal insert. In addition, the method aligns the metal insert at the more accurate position while a mold is assembled, by tapering the second sides of the fixing pins.
    Type: Application
    Filed: October 10, 2014
    Publication date: July 2, 2015
    Inventors: Jung Do Suh, Yong Suk Heo, Back Nam Kim, Jae Cheon Lee, Jin Yong Park
  • Publication number: 20130280231
    Abstract: Provided is a composition for preventing or treating obesity, and more particularly, a composition for preventing or treating obesity in order to treat or improve states of obese patients requiring weight control. The composition according to the present invention has advantages in that side effects by administration of the composition are not generated, and effects of losing weight and maintaining weight are excellent without changing food intake and consumption amounts, such that the composition may be effectively used to prevent overweight and obesity related diseases.
    Type: Application
    Filed: April 19, 2013
    Publication date: October 24, 2013
    Applicant: ELE Life Science Co., Ltd.
    Inventor: Jae Cheon LEE
  • Patent number: 6973852
    Abstract: The present invention relates to a parking brake lever of a vehicle.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: December 13, 2005
    Assignee: Kyung Chang Industrial Co., Ltd.
    Inventors: Hyun-Myung Shin, Moon-Hyuk Im, Jae-Cheon Lee, Tae-Ho Park, Kyung-Hee Cho, Byung-Hae Kim
  • Publication number: 20050092559
    Abstract: The present invention relates to a parking brake lever of a vehicle.
    Type: Application
    Filed: December 9, 2003
    Publication date: May 5, 2005
    Inventors: Hyun-Myung Shin, Moon-Hyuk Im, Jae-Cheon Lee, Tae-Ho Park, Kyung-Hee Cho, Byung-Hae Kim
  • Patent number: 6760942
    Abstract: An apparatus and method for determining a washing pattern of a direct drive inverter-type washing machine.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: July 13, 2004
    Assignee: LG Electronics Inc.
    Inventors: Chul Woong Lee, Jae Cheon Lee, Min Kyu Hwang
  • Publication number: 20020040259
    Abstract: An apparatus and method for determining a washing pattern of a direct drive inverter-type washing machine.
    Type: Application
    Filed: May 14, 2001
    Publication date: April 4, 2002
    Inventors: Chul Woong Lee, Jae Cheon Lee, Min Kyu Hwang
  • Patent number: 5946947
    Abstract: A clothes washing machine has an external casing, a tub suspended in the external casing, and a spin basket rotatably installed in the tub and accommodating laundry. A damper includes a first member installed at the lower end of the tub which can wobble together with the tub, and a second member for attenuating vibration transferred to the tub by a mutual action with respect to the first member. Nonlinear and irregular vibration transferred to the tub during a rotational movement of the spin basket can be effectively attenuated, to reduce noise of the washing machine and perform a more stable washing cycle operation.
    Type: Grant
    Filed: May 14, 1997
    Date of Patent: September 7, 1999
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joon Yeop Lee, Sung Jae Shin, Jae Cheon Lee, Yong Byeong Jeon