Abstract: A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.

Abstract: Manufacturing a device may include inspecting a surface of an inspection target device. The inspecting may include forming a metal layer on a surface of the inspection target device on which a minute pattern is formed, directing a beam of light to be incident and normal to the surface of the inspection target device, determining a spectrum of light reflected from the surface of the inspection target device, and generating, via the spectrum, information associated with a structural characteristic of the minute pattern formed on the inspection target device. The inspection target device may be selectively incorporated into the manufactured device based on the generated information.

Abstract: An optical inspection apparatus includes a broadband light source, a monochromator, an image obtaining apparatus, and an analysis device. The monochromator is configured to convert light from the broadband light source into a plurality of monochromatic beams of different wavelengths and sequentially output the monochromatic beams, where each beam has a preset wavelength width and corresponds to one of a plurality of different wavelength regions. The image obtaining apparatus is configured to allow each monochromatic beam output from the monochromator to be incident to a top surface of an inspection target without using a beam splitter, allow light reflected by the inspection target to travel in a form of light of an infinite light source, and generate 2D images of the inspection target. The analysis device is configured to analyze the 2D images of the inspection target in the plurality of wavelength regions.

Abstract: A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.

Abstract: Manufacturing a device may include inspecting a surface of an inspection target device. The inspecting may include forming a metal layer on a surface of the inspection target device on which a minute pattern is formed, directing a beam of light to be incident and normal to the surface of the inspection target device, determining a spectrum of light reflected from the surface of the inspection target device, and generating, via the spectrum, information associated with a structural characteristic of the minute pattern formed on the inspection target device. The inspection target device may be selectively incorporated into the manufactured device based on the generated information.

Abstract: A position measurement device includes a light source, a reflector coupled to a test object, a light detector between the light source and reflector, and a controller to measure a position of the test object based on an interference pattern generated by a reference beam and a measurement beam output from the light detector. The controller also controls a temperature of the light detector by generating signals for a heat exchanger having a Peltier region coupled to the light detector. The signals including a first signal to cause the heat exchanger to remove heat from the light receiver and a second signal to cause the heat exchanger to apply heat to the light receiver.