Patents by Inventor Jae-eung Koo

Jae-eung Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polish pad and chemical mechanical polishing apparatus comprising the same
    Patent number: 7364497
    Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: April 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-yong Park, Tae-hoon Lee, Jae-eung Koo
  • POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME
    Publication number: 20080090503
    Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.
    Type: Application
    Filed: November 16, 2007
    Publication date: April 17, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Moo-yong PARK, Tae-hoon LEE, Jae-eung KOO
  • Polishing pad and chemical mechanical polishing apparatus comprising the same
    Publication number: 20060003677
    Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.
    Type: Application
    Filed: June 30, 2005
    Publication date: January 5, 2006
    Inventors: Moo-yong Park, Tae-hoon Lee, Jae-eung Koo