Patents by Inventor Jae Gyeong LEE

Jae Gyeong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220178375
    Abstract: Disclosed is an electric water pump including: a main body; a motor module including a rotor and a stator to generate a rotational force with power supplied from an outside; a pump module coupled to a first side of the main body, and including an impeller spinning by the rotational force of the motor module, an inlet to introduce a fluid as the impeller spins, and an outlet; a controller housing coupled to a second side of the main body and coupling with a controller for controlling the motor module; and a rotary shaft transmitting the rotational force from the motor module to the impeller, wherein the rotor is formed by performing insert injection-molding after stacking a rotor core and coupling with a magnet, and the rotary shaft is pressed into the rotor so that the rotor and the rotary shaft can be formed as a single body.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 9, 2022
    Applicant: YoungShin Precision Co., Ltd
    Inventors: Do Jae JOO, Hong Ki KIM, Seong Wook CHA, Jae Gyeong LEE
  • Patent number: 11186749
    Abstract: A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: November 30, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Boyun Kim, Yeryung Jeon, Boun Yoon, Taek Dong Chung, Jae Gyeong Lee, Jin-Young Lee
  • Publication number: 20200392375
    Abstract: A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.
    Type: Application
    Filed: May 20, 2020
    Publication date: December 17, 2020
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Boyun KIM, Yeryung JEON, Boun YOON, Taek Dong CHUNG, Jae Gyeong LEE, Jin-Young LEE