Abstract: A stackable multi-chip package system is provided including forming an inter-chip structure adjacent to an external interconnect having both a base and a tip; connecting a first integrated circuit die and an outer portion of the base with the first integrated circuit die mounted over the inter-chip structure, connecting a second integrated circuit die and an inner portion of the base with the second integrated circuit die mounted under the inter-chip structure, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.

Abstract: An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.

Abstract: An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded strip protrusion formed therefrom over the in-line strip.

Abstract: An integrated circuit package system includes forming an integrated circuit stack having a bottom non-active side and a top non-active side; connecting an internal interconnect between a lead, having a top side and a bottom side, and the integrated circuit stack; and forming an encapsulation, having both a non-elevated portion and an elevated portion, around the integrated circuit stack and the internal interconnect with the top side exposed at the non-elevated portion, and with the bottom side, the bottom non-active side, and the top non-active side exposed.

Abstract: An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free.

Abstract: A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

Abstract: An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.

Abstract: A stackable multi-chip package system is provided including forming a first external interconnect having a first through hole and a second external interconnect having a second through hole, forming a first package subassembly having the first external interconnect and a first integrated circuit die, forming a second package subassembly having the second external interconnect and a second integrated circuit die, mounting the second package subassembly over the first package subassembly, and molding the first package subassembly and the second package subassembly.

Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.

Abstract: An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die.

Abstract: An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the sacrificial substrate; forming conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and removing the sacrificial substrate.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free.

Abstract: A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die and the base, stacking a second integrated circuit die over the first integrated circuit die in an active side to active side configuration, connecting the second integrated circuit die and the base, and molding the first integrated circuit die, the second integrated circuit die, and the external interconnect partially exposed.

Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.

Abstract: A method of manufacture of an integrated circuit package stacking system includes: providing a bottom package including: providing a first lead frame, forming a bottom package body having the first lead frame in an off-centered parting line position, and forming bottom connection leads of the first lead frame for providing coplanar contacts at an end of the bottom connection leads; mounting a top package on the bottom package including: providing a second lead frame, forming a top package body on the second lead frame, and reforming top connection leads of the second lead frame for over-lapping contact areas on the bottom connection leads of the bottom package; and applying a conductive adhesive on the contact areas for electrically connecting the top connection leads and the bottom connection leads.

Abstract: A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.

Abstract: An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

Abstract: A stackable multi-chip package system is provided including forming an external interconnect, having a base and a tip, and a paddle; mounting a first integrated circuit die over the paddle; stacking a second integrated circuit die over the first integrated circuit die in a active side to active side configuration; connecting the first integrated circuit die and the base; connecting the second integrated circuit die and the base; and molding the first integrated circuit die, the second integrated circuit die, the paddle, and the external interconnect with the external interconnect partially exposed.