Abstract: A modified conjugated diene-based polymer having high linearity and improved compounding properties is provided. The modified conjugated diene-based polymer includes phosphor, sulfur and chlorine in specific amount ranges, and the degree of branching is controlled, and accordingly, if applied to a rubber composition, tensile strength and viscoelasticity may be excellent, and processability may be markedly improved.

Abstract: A sidestream smoke removal device and a control method thereof are provided. The sidestream smoke removal device according to some embodiments of the present disclosure may include a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, and a heating portion disposed inside the housing to heat the smoking space. The heating portion may heat the smoking space to remove a smell generated due to by-products of smoking, and accordingly, the cleanliness of the sidestream smoke removal device can be improved.

Abstract: A complementary thin film transistor (TFT) includes a substrate and a first TFT and a second TFT disposed on the substrate, wherein a first conductive semiconductor layer of the first TFT and a second gate electrode layer of the second TFT are disposed in the same layer and include the same material.

Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.

Abstract: Systems and methods are described for wafer processin. A wafer processing apparatus includes: a first wafer transporter; a process station coupled to the first wafer transporter, the process station including: a first plurality of wafer processing stacks, each of the plurality of wafer processing stacks including a plurality of wafer processing modules, and a second wafer transporter coupled to the plurality of wafer processing modules, each of the plurality of wafer processing modules adjacent, and accessible by, the second wafer transporter; and a third wafer transporter coupled to the process station, wherein any of the plurality of wafer processing modules in any of the plurality of wafer processing stacks can be accessed by at least two adjacent wafer transporters from among the first, second and third wafer transporter.

Abstract: Methods and apparatus are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. A method for achieving a more uniform, quasi-equilibrium succession of states from the introduction of developer chemical to the wafer surface to its removal is also described. The method reduces process-induced defects and improves critical dimension (CD) control.

Abstract: Systems and methods are described for wafer processing. A wafer processing apparatus includes: a first wafer transporter; a process station coupled to the first wafer transporter, the process station including: a first plurality of wafer processing stacks, each of the plurality of wafer processing stacks including a plurality of wafer processing modules, and a second wafer transporter coupled to the plurality of wafer processing modules, each of the plurality of wafer processing modules adjacent, and accessible by, the second wafer transporter; and a third wafer transporter coupled to the process station, wherein any of the plurality of wafer processing modules in any of the plurality of wafer processing stacks can be accessed by at least two adjacent wafer transporters from among the first, second and third wafer transporter.

Abstract: Systems and methods are described for wafer processing. A wafer processing apparatus includes: a first wafer transporter; a process station coupled to the first wafer transporter, the process station including: a first plurality of wafer processing stacks, each of the plurality of wafer processing stacks including a plurality of wafer processing modules, and a second wafer transporter coupled to the plurality of wafer processing modules, each of the plurality of wafer processing modules adjacent, and accessible by, the second wafer transporter; and a third wafer transporter coupled to the process station, wherein any of the plurality of wafer processing modules in any of the plurality of wafer processing stacks can be accessed by at least two adjacent wafer transporters from among the first, second and third wafer transporter.