Patents by Inventor Jae Heung Lee

Jae Heung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10861685
    Abstract: The fluoro-based polymer composite target for sputtering according to the present invention is excellent in adhesion with a metal electrode to which a voltage is applied, can prevent bending, and is capable of stably forming plasma by imparting conductivity even with industrially widely used DC and MF power supply systems, thereby allowing a fluorinated polymer to be effectively deposited on an adherend by sputtering.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: December 8, 2020
    Assignee: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Sang Jin Lee, Jae Heung Lee, Woo Jin Choi, Cheol Hwan Kim, Sung Hyun Kim, Seong Geun Cho, Dong Seok Ham, Kwang Je Kim, Dong Soon Park, Jae Seong Park
  • Patent number: 10679972
    Abstract: A multi-chip package includes a package substrate including a first substrate pad, a first group of semiconductor chips stacked on the package substrate, each of the first group of the semiconductor chips including bonding pads, first stud bumps arranged on the bonding pads of the first group of the semiconductor chips except for a lowermost semiconductor chip in the first group, a first conductive wire downwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and connected to the first substrate pad, and a second conductive wire upwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and sequentially connected to the first stud bumps.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: June 9, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-Gil Han, Byong-Joo Kim, Yong-Je Lee, Jae-Heung Lee, Seung-Weon Ha
  • Patent number: 10658326
    Abstract: A bonding wire includes a wire core including a silver-palladium alloy. A coating layer is disposed on a sidewall of the wire core. A palladium content of the silver-palladium alloy ranges from about 0.1 wt % to about 1.5 wt %.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-Gil Han, Sangho An, Yong Je Lee, Jae Heung Lee, Seungweon Ha
  • Publication number: 20190103381
    Abstract: A multi-chip package includes a package substrate including a first substrate pad, a first group of semiconductor chips stacked on the package substrate, each of the first group of the semiconductor chips including bonding pads, first stud bumps arranged on the bonding pads of the first group of the semiconductor chips except for a lowermost semiconductor chip in the first group, a first conductive wire downwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and connected to the first substrate pad, and a second conductive wire upwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and sequentially connected to the first stud bumps.
    Type: Application
    Filed: November 16, 2018
    Publication date: April 4, 2019
    Inventors: Won-Gil HAN, Byong-Joo KIM, Yong-Je LEE, Jae-Heung LEE, Seung-Weon HA
  • Patent number: 10147706
    Abstract: A multi-chip package includes a package substrate including a first substrate pad, a first group of semiconductor chips stacked on the package substrate, each of the first group of the semiconductor chips including bonding pads, first stud bumps arranged on the bonding pads of the first group of the semiconductor chips except for a lowermost semiconductor chip in the first group, a first conductive wire downwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and connected to the first substrate pad, and a second conductive wire upwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and sequentially connected to the first stud bumps.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: December 4, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-Gil Han, Byong-Joo Kim, Yong-Je Lee, Jae-Heung Lee, Seung-Weon Ha
  • Publication number: 20180277341
    Abstract: The fluoro-based polymer composite target for sputtering according to the present invention is excellent in adhesion with a metal electrode to which a voltage is applied, can prevent bending, and is capable of stably forming plasma by imparting conductivity even with industrially widely used DC and MF power supply systems, thereby allowing a fluorinated polymer to be effectively deposited on an adherend by sputtering.
    Type: Application
    Filed: January 28, 2016
    Publication date: September 27, 2018
    Inventors: Sang Jin LEE, Jae Heung LEE, Woo Jin CHOI, Cheol Hwan KIM, Sung Hyun KIM, Seong Geun CHO, Dong Seok HAM, Kwang Je KIM, Dong Soon PARK, Jae Seong PARK
  • Publication number: 20180114776
    Abstract: A multi-chip package includes a package substrate including a first substrate pad, a first group of semiconductor chips stacked on the package substrate, each of the first group of the semiconductor chips including bonding pads, first stud bumps arranged on the bonding pads of the first group of the semiconductor chips except for a lowermost semiconductor chip in the first group, a first conductive wire downwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and connected to the first substrate pad, and a second conductive wire upwardly extended from the bonding pad of the lowermost semiconductor chip in the first group and sequentially connected to the first stud bumps.
    Type: Application
    Filed: June 15, 2017
    Publication date: April 26, 2018
    Inventors: Won-Gil HAN, Byong-Joo KIM, Yong-Je LEE, Jae-Heung LEE, Seung-Weon HA
  • Publication number: 20180026004
    Abstract: A bonding wire includes a wire core including a silver-palladium alloy, and a coating layer disposed on a sidewall of the wire core. A palladium content of the silver-palladium alloy ranges from about 0.1 wt % to about 1.5 wt %.
    Type: Application
    Filed: June 7, 2017
    Publication date: January 25, 2018
    Inventors: WON-GIL HAN, SANGHO AN, YONG JE LEE, JAE HEUNG LEE, SEUNGWEON HA
  • Patent number: 9015077
    Abstract: A method of and apparatus for encrypting and/or decrypting content according to broadcast encryption scheme. The decryption method includes: determining whether or not a revoked device among devices that have licenses for predetermined content is present; and according to the determination result, selectively decrypting a content key encrypted by using a key to prevent the revoked device from decrypting the predetermined content. By doing so, an unnecessary encryption process and decryption process that occur when there is no revoked device are avoided.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: April 21, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bong-seon Kim, Myung-sun Kim, Sung-hyu Han, Young-sun Yoon, Sun-nam Lee, Jae-heung Lee
  • Patent number: 8983071
    Abstract: A key management, user registration and deregistration for a digital rights management (DRM) system in a home network, using a hierarchical node topology. In the key management, node information is generated by allocating a pair of keys (a public key and a private key) to each node. A node tree is made by generating link information using the pair of keys and a content key. The link information is delivered from an upper node to a lower node using the node tree. The link information is obtained by encrypting a private key of a ‘TO’ node using a public key of a ‘FROM’ node. Accordingly, it is possible to realize a DRM system that protects content and easily accomplishes a binding mechanism and a revocation mechanism.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: March 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-hyu Han, Bong-seon Kim, Myung-sun Kim, Young-sun Yoon, Sun-nam Lee, Jae-heung Lee
  • Patent number: 8808587
    Abstract: The present invention relates to a method of preparing a microcapsule with a double-layered structure which comprises the steps of performing an interfacial polymerization of an amine-aldehyde prepolymer on droplets containing an inorganic metal precursor selected from carboxylate and alkoxide compounds, and hydrolyzing the including inorganic precursors for formation of inorganic inner layer. The method of the present invention can prepare a microcapsule with a double-layered structure of an inorganic inner layer and a polymer outer layer, which is effective for eluting and substituting a core material inside the capsule.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: August 19, 2014
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Hyun Min Jung, Yong Seok Kim, Jae Heung Lee, Jong Chan Won, Soon-Ryoung Hur
  • Patent number: 8586700
    Abstract: Disclosed is a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer using cyclic oligomers, and more particularly, to a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer by preparing a cyclic ether sulfone oligomer and a cyclic imide or amide oligomer and subjecting the cyclic ether sulfone oligomer and the cyclic imide or amide oligomer to ring-opening copolymerization in the presence of an alkali metal fluoride catalyst.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: November 19, 2013
    Assignee: Korea Reasearch Institute of Chemical Technology
    Inventors: Yong Seok Kim, Hyun Min Jung, Jong Chan Won, Jae Heung Lee
  • Patent number: 8419918
    Abstract: A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: April 16, 2013
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Young-Taik Hong, Hyung Dae Kang, Seog Je Kim, Jae Heung Lee
  • Publication number: 20130053530
    Abstract: Disclosed is a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer using cyclic oligomers, and more particularly, to a method for preparing a poly(ethersulfonimide or ethersulfonamide) copolymer by preparing a cyclic ether sulfone oligomer and a cyclic imide or amide oligomer and subjecting the cyclic ether sulfone oligomer and the cyclic imide or amide oligomer to ring-opening copolymerization in the presence of an alkali metal fluoride catalyst.
    Type: Application
    Filed: October 7, 2010
    Publication date: February 28, 2013
    Inventors: Yong Seok Kim, Hyun Min Jung, Jong Chan Won, Jae Heung Lee
  • Patent number: 8347076
    Abstract: A home domain building method and system that allow devices to join a home domain using smart cards. In the method, a master device reads device information from a smart card having a device ID and a device key as the device information of a guest device authenticated as a legal device and transmits a challenge request signal to the guest device, the guest device randomly generates a challenge value in response to the challenge request signal, the master device encrypts the challenge value using the device key of the guest device and transmits the encrypted challenge value to the guest device, the guest device decrypts the encrypted challenge value, and if the decrypted challenge value is the same as the challenge value generated in response to the challenge request signal, the guest device allows the master device to join the guest device in the home domain.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: January 1, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-heung Lee, Myung-sun Kim, Su-hyun Nam, Yong-jin Jang, Yang-lim Choi
  • Patent number: 8341402
    Abstract: Provided is a method of controlling content access in a home network. The method includes: (a) defining a predetermined sub group and allocating a sub group key for the sub group; and (b) checking whether a user belongs to the sub group and transmitting the sub group key to a user device requested by the user, wherein the user device obtains an encrypted content key using a domain key and the sub group key. Since a content key is twice encrypted using a domain key and a sub group key and transmitted to a user device, it is possible to provide authorized content access to a user.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: December 25, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-hyu Han, Myung-sun Kim, Young-sun Yoon, Sun-nam Lee, Bong-seon Kim, Jae-heung Lee
  • Patent number: 8316689
    Abstract: Provided is a method for quantitative evaluation of mar- and scratch-induced surface damage on polymeric and coating materials. The method for quantitative evaluation of scratch-induced damage on polymeric and coating materials includes: preparing a test specimen of polymeric and coating materials; inducing a scratch damage on the surface of the test specimen; representing the scratch damage formed on the test specimen as corresponding color coordinates; and calculating a quantitated scratch damage index from a combination of a load applied to the surface of the test specimen and the color coordinates corresponding to the scratch damage.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: November 27, 2012
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Jong Il Weon, Si Yong Song, Jong Bae Lee, Kil Yeong Choi, Sung Goo Lee, Jae Heung Lee
  • Patent number: 8301571
    Abstract: A method of packaging broadcast contents are provided. The method includes: extracting a copy control bit from input broadcast contents and determining whether the broadcast contents will be stored after being encrypted based on the extracted copy control bit; creating usage rule information which includes an encryption method of the broadcast contents if it is determined that the broadcast contents will be stored after being encrypted; extracting the copy control bit from each new broadcast content sequentially input and detecting broadcast contents which include copy control bits indicating that the broadcast contents will be stored without being encrypted; and encrypting the input broadcast contents through the broadcast contents before the detected broadcast contents using the encryption method and packaging and storing the encrypted broadcast contents and the usage rule information.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: October 30, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-nam Lee, Myung-sun Kim, Sung-hyu Han, Young-sun Yoon, Jae-heung Lee, Bong-seon Kim, Moon-young Choi
  • Patent number: 8234493
    Abstract: A method for transmitting content to a user device from a home server in a home network is provided. The method includes: receiving an allocated user public key and a user private key of a user to whom the home server belongs; generating an arbitrary session public key and a session private key, generating an encrypted session private key by encrypting the session private key using a device public key that is a public key of the user device, and transmitting the encrypted session private key to the user device; and transmitting the content encrypted using a predetermined content key and a content key encrypted using the session private key to the user device. According to the method, by binding the content to each user, instead of to each device, the content can be safely and conveniently shared.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: July 31, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung-sun Kim, Sung-hyu Han, Yong-kuk You, Young-sun Yoon, Bong-seon Kim, Jae-heung Lee
  • Patent number: 8161296
    Abstract: A method and apparatus for managing digital content, which can detect the leakage of an encryption key when the encryption key used for encrypting the digital content is leaked or cracked. When the encrypted digital content is decrypted by an illegal device, a module linked with the encrypted digital content is automatically driven and a digital content managing apparatus is then notified that the encrypted digital content has been decrypted by the illegal device such that the digital content managing apparatus can change the encryption key. Thus, it is possible to prevent the digital content from being continuously leaked due to the use of the same encryption key for encrypting subsequent digital content.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: April 17, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung-sun Kim, Young-sun Yoon, Sun-nam Lee, Bong-seon Kim, Jae-heung Lee, Sung-hyu Han