Patents by Inventor Jae-Heung YE

Jae-Heung YE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11178799
    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 16, 2021
    Inventors: Hae-Jin Lee, Oh-Hyuck Kwon, Min Park, Jung-Je Bang, Jae-Deok Lim, Kyung-Ha Koo, Jae-Heung Ye, Chang-Tae Kim, Chi-Hyun Cho
  • Patent number: 10470345
    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Heung Ye, Jung-Je Bang, Jeong-Ung Kim, Ki-Youn Jang
  • Patent number: 10431887
    Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: October 1, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jun-Young Kim, Sang-Seob Kim, Min Park, Jung-Je Bang, Beom-Ju Kim, Jae-Heung Ye, Yong-Won Lee, Jung-Sik Park
  • Publication number: 20180288908
    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Inventors: Hae-Jin LEE, Oh-Hyuck Kwon, Min Park, Jung-Je Bang, Jae-Deok Lim, Kyung-Ha Koo, Jae-Heung Ye, Chang-Tae Kim, Chi-Hyun Cho
  • Patent number: 10010016
    Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: June 26, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-deok Lim, Jung-je Bang, Hyun-tae Jang, Hye-in Park, Jae-heung Ye, Chan-beom Jeong, Sae-bom Lee, Yong-won Lee
  • Publication number: 20180131087
    Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.
    Type: Application
    Filed: November 8, 2017
    Publication date: May 10, 2018
    Inventors: Jun-Young KIM, Sang-Seob KIM, Min PARK, Jung-Je BANG, Beom-Ju KIM, Jae-Heung YE, Yong-Won LEE, Jung-Sik PARK
  • Patent number: 9888586
    Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: February 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Je Bang, Yong-Won Lee, Jeong-Ung Kim, Jae-Heung Ye
  • Publication number: 20170318713
    Abstract: A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.
    Type: Application
    Filed: March 31, 2017
    Publication date: November 2, 2017
    Inventors: Jung-Je Bang, Min Park, Jae-Heung Ye, Yong-won Lee, Sang-Seob Kim, Jun-Yeong Kim
  • Publication number: 20170215306
    Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.
    Type: Application
    Filed: January 25, 2017
    Publication date: July 27, 2017
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae-deok LIM, Jung-je BANG, Hyun-tae JANG, Hye-in PARK, Jae-heung YE, Chan-beom JEONG, Sae-bom LEE, Yong-won LEE
  • Publication number: 20170202093
    Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.
    Type: Application
    Filed: January 12, 2017
    Publication date: July 13, 2017
    Inventors: Jung-Je Bang, Yong-Won Lee, Jeong-Ung Kim, Jae-Heung Ye
  • Publication number: 20170172020
    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 15, 2017
    Inventors: Jae-Heung YE, Jung-Je BANG, Jeong-Ung KIM, Ki-Youn JANG