Patents by Inventor Jae-Ho BOO

Jae-Ho BOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10236568
    Abstract: The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; a sub sheet layer bonded onto the main sheet layer by the first adhesive layer while the sub sheet layer forms a line structure having diagonal lines, which do not match directions of horizontal and vertical lines of the mesh structure of the thermosetting resin of which the main sheet layer is made, in order for the main sheet layer to have rigidity to maintain the curved state; a second adhesive layer formed on the sub sheet layer; and a pattern forming layer bonded onto the sub sheet layer by the second adhesive layer.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: March 19, 2019
    Assignee: HANSOL TECHNICS INC.
    Inventors: Jae-Ho Boo, Chi-Young Choi
  • Publication number: 20180097283
    Abstract: Provided is a curved-type rigid board. The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; and a pattern forming layer bonded onto the main sheet layer by the first adhesive layer.
    Type: Application
    Filed: November 9, 2015
    Publication date: April 5, 2018
    Inventors: Jae-Ho BOO, Chi-Young CHOI