Patents by Inventor Jae-Ho CHANG

Jae-Ho CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phosphine precursor for preparing quantum dot and quantum dot prepared therefrom
    Patent number: 11912915
    Abstract: The present invention relates to a phosphine precursor for the preparation of a quantum dot, and a quantum dot prepared therefrom. Using the phosphine precursor for the preparation of a quantum dot of the present invention, a quantum dot with improved luminous efficiency and higher luminous color purity can be provided.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 27, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Hee Il Chae, Jeong Ho Park, Kyung Sil Yoon, Ju-Sik Kang, Yu Mi Chang, Nam-Choul Yang, Jae Kyun Park, Song Lee
  • Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same
    Patent number: 10903199
    Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: January 26, 2021
    Assignee: Hyundai Autron Co., Ltd.
    Inventors: Jae-Ho Chang, Eun-Jung Kim, Jae-Woo Joung
  • Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same
    Patent number: 10748887
    Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: August 18, 2020
    Assignee: Hyundai Autron Co., Ltd.
    Inventors: Jae-Ho Chang, Eun-Jung Kim, Jae-Woo Joung
  • METHOD FOR DESIGNING VEHICLE CONTROLLER-ONLY SEMICONDUCTOR BASED ON DIE AND VEHICLE CONTROLLER-ONLY SEMICONDUCTOR BY THE SAME
    Publication number: 20170103974
    Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.
    Type: Application
    Filed: December 22, 2016
    Publication date: April 13, 2017
    Inventors: Jae-Ho CHANG, Eun-Jung KIM, Jae-Woo JOUNG
  • METHOD FOR DESIGNING VEHICLE CONTROLLER-ONLY SEMICONDUCTOR BASED ON DIE AND VEHICLE CONTROLLER-ONLY SEMICONDUCTOR BY THE SAME
    Publication number: 20160180013
    Abstract: The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.
    Type: Application
    Filed: December 7, 2015
    Publication date: June 23, 2016
    Inventors: Jae-Ho CHANG, Eun-Jung KIM, Jae-Woo JOUNG