Abstract: The present disclosure provides mimic molecules that are capable of specifically targeting a FAM19A5 protein, and thereby, inhibiting, reducing, and/or dissociating the interaction between members of the LRRC4 protein family and the FAM19A5 protein. The present disclosure also provides methods for promoting neurite outgrowth, by administering a mimic molecule described herein.

Abstract: Provided are surgical instrument including a base body, a shaft unit extending in a direction from the base body and having an end at which an end effector is mounted, a gear unit including a first gear mounted on the base body and a second gear mounted on another end of the shaft unit and engaged with the first gear, and a bearing unit positioned between the base body and the first gear.

Abstract: A composition for prevention or treatment of pulmonary fibrosis comprising chromenone derivatives represented by Formula I of the present invention or pharmaceutically acceptable salts thereof as an active ingredient, produces altered heat shock protein 27 (HSP27) dimers, thereby preventing normal HSP27 non-phosphorylated polymers from performing a chaperone function and reducing a cell protection function that chaperone originally performs. Thus the inventive composition has a remarkable inhibitory effect on pulmonary fibrosis, in particular, an irradiation-induced pulmonary fibrosis phenomenon.

Abstract: A composition for prevention or treatment of pulmonary fibrosis comprising chromenone derivatives represented by Formula I of the present invention or pharmaceutically acceptable salts thereof as an active ingredient, produces altered heat shock protein 27 (HSP27) dimers, thereby preventing normal HSP27 non-phosphorylated polymers from performing a chaperone function and reducing a cell protection function that chaperone originally performs. Thus the inventive composition has a remarkable inhibitory effect on pulmonary fibrosis, in particular, an irradiation-induced pulmonary fibrosis phenomenon.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Abstract: A light-emitting device includes a first lead frame and a second lead frame spaced apart from each other, the first and second lead frames each including a first portion, and a second portion disposed on the first portion, a light-emitting diode chip disposed on the second portion of the first or second lead frame, and a resin at least partially covering the first and second lead frames. The first and second portions of the first lead frame have different planar shapes from each other, the first and second portions of the second lead frame have different planar shapes from each other, and the second portion of the first or second lead frame includes a first fixing element. A first space is disposed between the first portion of the first lead frame and the first portion of the second lead frame, and the first fixing element is disposed on the first space.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: A light-emitting device includes a first lead frame and a second lead frame spaced apart from each other, the first and second lead frames each including a first portion, and a second portion disposed on the first portion, a light-emitting diode chip disposed on the second portion of the first or second lead frame, and a resin at least partially covering the first and second lead frames. The first and second portions of the first lead frame have different planar shapes from each other, the first and second portions of the second lead frame have different planar shapes from each other, and the second portion of the first or second lead frame includes a first fixing element. A first space is disposed between the first portion of the first lead frame and the first portion of the second lead frame, and the first fixing element is disposed on the first space.

Abstract: The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.

Abstract: An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.

Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.