Patents by Inventor Jae-Ho Kim

Jae-Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079834
    Abstract: A removable fastening system includes a rail unit located in a vehicle, an electrode portion located at the inner side of the rail unit, a fixing unit having one end inserted to be fixed to the rail unit, and a mounting unit mounted at another end of the fixing unit, wherein the fixing unit is inserted into the rail unit and has a conductive portion rotated to be brought into contact with the electrode portion.
    Type: Application
    Filed: May 19, 2023
    Publication date: March 7, 2024
    Inventors: Ji Seob PARK, Ji Ah Kim, Jin Ho Hwang, Jae Yong Lee, Dong Ju Lee
  • Publication number: 20240078471
    Abstract: Disclosed is a method of integrally optimizing different types of parameters that require setting during a machine learning process. The disclosed method of integrally optimizing the parameters includes performing training on a machine learning model by selecting sensor parameters and machine learning model hyperparameters until a predetermined termination condition is satisfied; and determining, among the selected sensor parameters and machine learning model hyperparameters, an optimized sensor parameter and optimized machine learning model hyperparameter that minimize a loss value for the machine learning model, wherein the performing of the training on the machine learning model includes selecting the sensor parameters and machine learning model hyperparameters that satisfy a predetermined optimization range, and performing training on the machine learning model based on sensor data provided from a sensor by the selected sensor parameters and the machine learning model hyperparameters.
    Type: Application
    Filed: September 4, 2023
    Publication date: March 7, 2024
    Inventors: Jae Ho KIM, Yu Jin KIM, Ju Yeon WEON, Se Jung KIM, Tae In YONG
  • Patent number: 11925116
    Abstract: Provide are a compound capable of improving the light-emitting efficiency, stability, and lifespan of an element, an organic electronic element using same, and an electronic device thereof.
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: March 5, 2024
    Assignee: DUK SAN NEOLUX CO., LTD.
    Inventors: Hyun Ju Song, Jae Ho Kim, Junggeun Lee, Ki Hwan Yoon
  • Patent number: 11923872
    Abstract: A bit interleaver, a bit-interleaved coded modulation (BICM) device and a bit interleaving method are disclosed herein. The bit interleaver includes a first memory, a processor, and a second memory. The first memory stores a low-density parity check (LDPC) codeword having a length of 64800 and a code rate of 7/15. The processor generates an interleaved codeword by interleaving the LDPC codeword on a bit group basis. The size of the bit group corresponds to a parallel factor of the LDPC codeword. The second memory provides the interleaved codeword to a modulator for quadrature phase shift keying (QPSK) modulation.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: March 5, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sung-Ik Park, Sun-Hyoung Kwon, Jae-Young Lee, Heung-Mook Kim, Nam-Ho Hur
  • Publication number: 20240069310
    Abstract: A lens includes a lens unit; an intermediate layer configured to cover a surface portion of the lens unit; and a water-repellent layer, configured to cover a surface portion of the intermediate layer, including a base layer and an ultraviolet (UV) absorber disposed in the base layer.
    Type: Application
    Filed: March 16, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Byung Ju KIM, Jung Ho LEE, Na Yi KANG, Joung Hun KIM, Jae Goon AUM
  • Publication number: 20240071895
    Abstract: A semiconductor package may include a lower redistribution layer including a lower wiring and a lower via, an embedded region on the lower redistribution layer, a core layer on the lower redistribution layer and including a core via, and an under bump structure including an under bump pad on a lower surface of the lower redistribution layer and an under bump via connecting the lower wiring and the under bump pad, the under bump pad may overlap the under bump via, the lower via, and the core via in a plan view, and the under bump via may be spaced apart from at least one of the lower via and the core via in the plan view.
    Type: Application
    Filed: July 17, 2023
    Publication date: February 29, 2024
    Inventors: Seoeun KYUNG, Byung Ho KIM, Youngbae KIM, Hongwon KIM, Seokwon LEE, Jae-Ean LEE, Dahee KIM
  • Publication number: 20240067065
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 29, 2024
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Publication number: 20240072020
    Abstract: A semiconductor package may include a lower structure, a first semiconductor chip on the lower structure, the first semiconductor chip including a hot spot, a second semiconductor chip horizontally spaced apart from the first semiconductor chip on the lower structure, and a connection chip in the lower structure and connecting the first and second semiconductor chips to each other. The hot spot may vertically overlap the connection chip.
    Type: Application
    Filed: March 23, 2023
    Publication date: February 29, 2024
    Inventors: JAE CHOON KIM, Hwanjoo PARK, Sunggu KANG, SUNG-HO MUN
  • Publication number: 20240074249
    Abstract: The present disclosure relates to a display device and a manufacturing method thereof, and a display device according to one or more embodiments includes a substrate, a transistor above the substrate, a first pixel electrode connected to the transistor, a scattering layer above the first pixel electrode, and defining repeating protrusions and depressions, a second pixel electrode above the scattering layer, and connected with the first pixel electrode, an emission layer above the second pixel electrode, and a common electrode above the emission layer.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Yang-Ho JUNG, Woong Sik KIM, Kab Jong SEO, Jun Ho SIM, Jae Hun LEE
  • Publication number: 20240067619
    Abstract: Provided are a method for preparing chiral maleimide derivatives using (R,R)-1,2-diphenylethylenediamine (DPEN)-based organic chiral catalyst compounds and water as an eco-friendly solvent, and the like. It is possible to prepare chiral maleimide derivatives having high enantioselectivity even with a small amount of catalyst in an excellent yield within a short time. In particular, the preparation method of the present disclosure can stabilize a transition state through an interfacial reaction between the catalyst and water. In addition, spironolactone derivatives are synthesized using chiral maleimide derivatives prepared according to the present disclosure to be usefully used for the treatment of edema control, heart failure, liver cirrhosis, electrolyte abnormalities, hypertension, etc.
    Type: Application
    Filed: June 14, 2023
    Publication date: February 29, 2024
    Inventors: Hyeon Soo KIM, Jae Ho SHIM
  • Patent number: 11916878
    Abstract: Disclosed are an apparatus and a method for Internet of Things (IoT) device security. The method includes unifying a port in a first IoT device for communication, receiving, by the first IoT device, a packet from a second IoT device through the port, identifying whether the packet in the first IoT device is in a preset packet form, verifying content of the packet in the first IoT device when the packet is in the preset packet form, and opening the port for providing a service in the first IoT device when the verifying of the packet content is successful.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: February 27, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yun-Kyung Lee, Kyeong Tae Kim, Young Ho Kim, Jeong Nyeo Kim, Seon-Gyoung Sohn, Jae Deok Lim
  • Patent number: 11912027
    Abstract: An inkjet printing apparatus includes a stage on which a target substrate is mounted, and an inkjet head positioned above the stage, wherein the inkjet head includes an ejection part including a plurality of nozzles that spray ink containing a plurality of particles, a filter part disposed above the ejection part, and selectively passing the plurality of particles, and an electric field generating electrode that is disposed in the filter part and generates an electric field in the filter part.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sung Ho Park, Kyong Sub Kim, Jae Won Choi
  • Patent number: 11910737
    Abstract: Provided is a method of automatically combining a farm vehicle with a work machine including confirming a current position of the work machine, moving a farm vehicle into a range having a predetermined radius around the current position, and controlling the farm vehicle, on the basis of a current position and direction of a first coupling unit included in the work machine, so that the first coupling unit and a second coupling unit included in the farm vehicle are coupled to each other.
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: February 27, 2024
    Assignee: GINT Co., Ltd.
    Inventors: Yong Hyeon Kim, Seung Rak Son, Jae Ho Song, Byung Sun Kim, Yeon Tae Kim
  • Patent number: 11913064
    Abstract: An optical gene biosensor is disclosed. The optical gene biosensor includes a substrate; a molecular beacon anchored to the substrate, wherein the molecular beacon includes an oligonucleotide specifically binding to a target nucleic acid molecule and a first compound bound to a first terminal of the oligonucleotide; an optical marker specifically binding to the first compound, wherein the optical marker is configured to retro-reflect irradiated light; a light source for irradiating the optical marker with light; and a light-receiver for receiving light retro-reflected from the optical marker. The optical gene biosensor may perform accurate quantitative analysis of a target nucleic acid molecule using both non-spectral and spectral light sources.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: February 27, 2024
    Assignee: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Hyun-Chul Yoon, Jae-Ho Kim, Yong-Duk Han, Hyeong-Jin Chun
  • Patent number: 11917148
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: February 27, 2024
    Assignees: Electronics And Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Hanbat National University Industry-Academic Cooperation Foundation
    Inventors: Jin-Ho Lee, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Dong-San Jun, Ha-Hyun Lee, Seung-Hyun Cho, Hui-Yong Kim, Hae-Chul Choi, Dae-Hyeok Gwon, Jae-Gon Kim, A-Ram Back
  • Publication number: 20240023329
    Abstract: A semiconductor device, and a method for manufacturing the semiconductor device, includes a discharge interconnection structure and a source structure on the discharge interconnection structure. The semiconductor device also includes a first discharge contact structure extending through the source structure to be electrically connected to the discharge interconnection structure, the first discharge contact structure having a first depth. The semiconductor device further includes a second discharge contact structure positioned in the source structure, the second discharge contact structure having a second depth different from the first depth.
    Type: Application
    Filed: December 7, 2022
    Publication date: January 18, 2024
    Applicant: SK hynix Inc.
    Inventor: Jae Ho KIM
  • Publication number: 20240023331
    Abstract: A semiconductor memory device including a substrate also includes a source stack and a preliminary source stack spaced apart from each other and arranged over the substrate. The semiconductor memory device additionally includes a conductive contact plug passing through the source stack and a charge dispersion layer passing through a portion of the preliminary source stack.
    Type: Application
    Filed: January 17, 2023
    Publication date: January 18, 2024
    Applicant: SK hynix Inc.
    Inventors: Jae Min LEE, Jae Ho KIM
  • Publication number: 20240010050
    Abstract: The present invention relates to a vehicle air conditioner having a photocatalyst module, i.e., a two-layered flow air conditioner in which an inner flow path of the air conditioner is divided into an upper flow path and a lower flow path, the air conditioner providing an optimal design location and a mounting structure of a photocatalyst module which are capable of purifying both the upper flow path and the lower flow path by using a minimum number of photocatalyst modules.
    Type: Application
    Filed: December 28, 2021
    Publication date: January 11, 2024
    Applicant: Hanon Systems
    Inventors: Jae Ho KIM, Ji-Yong PARK, Tae Yong PARK, Su Jin WOO, Sung Je LEE
  • Publication number: 20230415548
    Abstract: The present invention relates to a vehicle air conditioner, and more particularly, to a vehicle air conditioner having a photocatalyst module, which provides an optimal design location or a mounting structure in which the photocatalyst module is mounted on an upper surface of a duct, the upper surface of the duct has a predetermined inclination with respect to a floor surface, and the photocatalyst module is mounted on a left/right independent air conditioner.
    Type: Application
    Filed: December 28, 2021
    Publication date: December 28, 2023
    Inventors: Jae Ho KIM, Ji-Yong PARK, Tae Yong PARK, Su Jin WOO, Sung Je LEE
  • Publication number: 20230411465
    Abstract: A semiconductor device includes a first contact plug penetrating a source structure, the first plug having a first portion having a first width and a second portion having a second width that is larger than the first width, a stack formed on the source structure and the first contact plug, a second contact plug penetrating the stack, the second contact plug connected to the first contact plug, a first spacer surrounding the first portion and the second portion of the first contact plug, and a second spacer surrounding the first spacer to surround the second portion of the first contact plug.
    Type: Application
    Filed: November 4, 2022
    Publication date: December 21, 2023
    Applicant: SK hynix Inc.
    Inventor: Jae Ho KIM