Patents by Inventor Jae Hong Shin
Jae Hong Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11957669Abstract: One aspect of the present disclosure is a pharmaceutical composition which includes (R)—N-[1-(3,5-difluoro-4-methansulfonylamino-phenyl)-ethyl]-3-(2-propyl-6-trifluoromethyl-pyridin-3-yl)-acrylamide as a first component and a cellulosic polymer as a second component, wherein the composition of one aspect of the present disclosure has a formulation characteristic in which crystal formation is delayed for a long time.Type: GrantFiled: August 10, 2018Date of Patent: April 16, 2024Assignee: AMOREPACIFIC CORPORATIONInventors: Joon Ho Choi, Won Kyung Cho, Kwang-Hyun Shin, Byoung Young Woo, Ki-Wha Lee, Min-Soo Kim, Jong Hwa Roh, Mi Young Park, Young-Ho Park, Eun Sil Park, Jae Hong Park
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Publication number: 20240103438Abstract: A method and a system thereof for producing a digital holographic screen based on multi-hogel printing are proposed. The system includes a light source unit including lasers, a dichroic mirror for RGB three color matching, mirrors, a beam splitter, and an optical shutter, an object beam unit including a spatial filter, a lens, and a mirror, a reference beam unit including a spatial filter, a lens, and a mirror, a diffuser fixing unit including a diffuser holder and a diffuser positioned between the object beam unit and a recording material and configured to scatter and diffuse the object beam, a photomask movement unit including a photomask holder, an XY-translation stage, and a photomask positioned between the reference beam unit and the recording medium and on which a grid-shaped on/off binary pattern is printed, and a controller configured to control the optical shutter and the XY-translation stage.Type: ApplicationFiled: November 11, 2021Publication date: March 28, 2024Inventors: Dong Hak SHIN, Yong Seok OH, Jae Hong KIM, Jong sung JUNG, Jae Woo PARK, Jun Yong CHOI
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Publication number: 20240097174Abstract: The present disclosure relates to a secondary battery manufacturing system having a multi-packaging unit, in which multiple packaging units of a secondary battery manufacturing facility are provided and a transfer box on which an electrode assembly is accommodated is transferred to each packaging unit by a transfer unit, wherein the secondary battery manufacturing system includes: an electrode supply unit equipped with a plurality of stacking devices for supplying an electrode assembly in which a plurality of battery cells are stacked; a tab-welding unit; at least one packaging unit; at least one temporary buffer; and a transfer unit.Type: ApplicationFiled: September 14, 2023Publication date: March 21, 2024Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
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Publication number: 20240079630Abstract: The present disclosure relates to a secondary battery manufacturing system in which a packaging unit of a secondary battery manufacturing facility are configured to have multiple packaging units, and having a multipackaging unit such that a transfer box in which an electrode assembly is seated is transferred to each of the packaging units by a transfer unit, and including an electrode supply unit having a plurality of stacking devices supplying an electrode assembly in which a plurality of battery cells are stacked, a tab welding unit, at least one packaging unit, at least one temporary buffer, and a transfer unit.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Yong Uk SHIN, Sang Sik CHO, Dae Woon NAM, Dong Jin PARK, Jae Gyun CHOI, Chi Hong AN
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Patent number: 11925021Abstract: A semiconductor device, and method of manufacturing a semiconductor device, includes second conductive patterns separated from each other above a first stack structure which is penetrated by first channel structures and enclosing second channel structures coupled to the first channel structures, respectively. Each of the second conductive patterns includes electrode portions stacked in a first direction and at least one connecting portion extending in the first direction to be coupled to the electrode portions.Type: GrantFiled: December 13, 2021Date of Patent: March 5, 2024Assignee: SK hynix Inc.Inventors: Young Geun Jang, Wan Sup Shin, Ki Hong Lee, Jae Jung Lee
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Publication number: 20220383993Abstract: The present disclosure provides a method of generating compound information in a computing apparatus, the method including obtaining a learning model for information associated with partial structures, obtaining information associated with a source molecule that is a target of a partial structure modification, obtaining information associated with a partial structure set including a plurality of partial structures of the source molecule, selecting, from the partial structures included in the partial structure set, a target partial structure to be modified, obtaining, using the learning model, information associated with a modified partial structure corresponding to the target partial structure, and outputting result information in which the target partial structure is replaced by the modified partial structure in the source molecule.Type: ApplicationFiled: October 20, 2020Publication date: December 1, 2022Inventors: Ji Ho YOO, Min Kyu HA, Jong Hwan CHAE, Chi Won SON, Sang Hyung JIN, Jae Hong SHIN, Han Jo KIM, Si U KIM, Sang Ok SONG
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Patent number: 9519184Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: GrantFiled: June 27, 2014Date of Patent: December 13, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dae Yeon Kim, Young June Jeong, Hun Joo Hahm, Jae Hong Shin, Chang Ho Shin
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Publication number: 20140313696Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: ApplicationFiled: June 27, 2014Publication date: October 23, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dae Yeon KIM, Young June JEONG, Hun Joo HAHM, Jae Hong SHIN, Chang Ho SHIN
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Patent number: 8764212Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: GrantFiled: March 9, 2009Date of Patent: July 1, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Dae Yeon Kim, Young June Jeong, Hun Joo Hahm, Jae Hong Shin, Chang Ho Shin
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Publication number: 20130009558Abstract: There is provided a backlight unit (BLU). The BLU may include: a plurality of LED modules, each LED module including a plurality of LEDs; and one or more driving drivers controlling brightness of the plurality of LEDs included in each of the plurality of LED modules, wherein at least two LED modules among the plurality of LED modules are commonly connected to one of the driving drivers in parallel.Type: ApplicationFiled: October 7, 2010Publication date: January 10, 2013Inventors: Ji Young An, Jae Hong Shin
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Patent number: 8220944Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: GrantFiled: October 8, 2010Date of Patent: July 17, 2012Assignee: Samsung LED Co., Ltd.Inventors: Dae Yeon Kim, Young June Jeong, Hun Joo Hahm, Jae Hong Shin, Chang Ho Shin
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Patent number: 8182106Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.Type: GrantFiled: March 11, 2011Date of Patent: May 22, 2012Assignee: Samsung LED Co., LtdInventors: Jae Hong Shin, Hun Joo Hahm, Hyung Suk Kim, Chang Ho Shin, Dae Yeon Kim, Chul Hee Yoo, Dong Hyun Cho
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Publication number: 20110157492Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.Type: ApplicationFiled: March 11, 2011Publication date: June 30, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Jae Hong SHIN, Hun Joo HAHM, Hyung Suk KIM, Chang Ho SHIN, Dae Yeon KIM, Chul Hee YOO, Dong Hyun CHO
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Patent number: 7946724Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.Type: GrantFiled: April 3, 2008Date of Patent: May 24, 2011Assignee: Samsung LED Co., LtdInventors: Jae Hong Shin, Hun Joo Hahm, Hyung Suk Kim, Chang Ho Shin, Dae Yeon Kim, Chul Hee Yoo, Dong Hyun Cho
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Patent number: 7905618Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: GrantFiled: July 18, 2008Date of Patent: March 15, 2011Assignee: Samsung LED Co., Ltd.Inventors: Dae Yeon Kim, Young June Jeong, Hun Joo Hahm, Jae Hong Shin, Chang Ho Shin
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Publication number: 20110026241Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: ApplicationFiled: October 8, 2010Publication date: February 3, 2011Applicant: SAMSUNG LED CO., LTDInventors: Dae Yeon KIM, Young June JEONG, Hun Joo HAHM, Jae Hong SHIN, Chang Ho SHIN
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Publication number: 20090168399Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: ApplicationFiled: March 9, 2009Publication date: July 2, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Yeon KIM, Young June Jeong, Hun Joo Hahm, Jae Hong Shin, Chang Ho Shin
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Publication number: 20090059579Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.Type: ApplicationFiled: April 3, 2008Publication date: March 5, 2009Inventors: Jae Hong Shin, Hun Joo Hahm, Hyung Suk Kim, Chang Ho Shin, Dae Yeon Kim, Chul Hee Yoo, Dong Hyun Cho
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Publication number: 20090021932Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: ApplicationFiled: July 18, 2008Publication date: January 22, 2009Inventors: Dae Yeon KIM, Young June JEONG, Hun Joo HAHM, Jae Hong SHIN, Chang Ho SHIN
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Publication number: 20020038270Abstract: The present invention provides a method for transacting publicly-offered culture stocks using the internet, having a membership obtainment step for transactions, a public offering step and a stock listing step.Type: ApplicationFiled: December 15, 2000Publication date: March 28, 2002Inventors: Jae Hong Shin, Tae Min Oh