Patents by Inventor Jae Hong YOO

Jae Hong YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12123903
    Abstract: A static electricity visualization apparatus capable of visually identifying a measured level of static electricity is provided.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: October 22, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Jun Ho Oh, Kwang Sup Kim, Jae Hong Kim, Kyung Hun Jang, Young Ho Park, Jong Min Lee, Yeon Chul Song, Sang Min Ha, Ji Hoon Yoo, Myeong Jun Lim
  • Publication number: 20240339561
    Abstract: A light emitting element may include a semiconductor stack structure including an N-type semiconductor layer, a P-type semiconductor layer, and an active layer disposed between the N-type semiconductor layer and the P-type semiconductor layer, and an insulating layer disposed on a side portion of the semiconductor stack structure. The semiconductor stack structure may include a fluorinated area disposed adjacent to the insulating layer.
    Type: Application
    Filed: March 14, 2024
    Publication date: October 10, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Ji Song CHAE, Dae Hyun KIM, Sang Ho PARK, Jae Woong YOO, Chul Jong YOO, Sang Hoon LEE, Joo Hee LEE, Jin Hyuk JANG, Sang Ho JEON, Seon Hong CHOI
  • Publication number: 20240084171
    Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
  • Patent number: 11787974
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: October 17, 2023
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Weoun Gyuen Moon, Jae Hyun Kim, Kyu Soon Shin, Jong Dai Park, Min Gun Lee, Sung Hoon Jin, Goo Hwa Lee, Gyeong Sook Cho, Jae Hong Yoo
  • Publication number: 20210340405
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Application
    Filed: June 30, 2021
    Publication date: November 4, 2021
    Inventors: Weoun Gyuen MOON, Jae Hyun KIM, Kyu Soon SHIN, Jong Dai PARK, Min Gun LEE, Sung Hoon JIN, Goo Hwa LEE, Gyeong Sook CHO, Jae Hong YOO