Patents by Inventor Jae Hong YOO

Jae Hong YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ORGANIC LAYER POLISHING COMPOSITION AND METHOD FOR POLISHING USING SAME
    Publication number: 20240084171
    Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
  • Chemical-mechanical polishing particle and polishing slurry composition comprising same
    Patent number: 11787974
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: October 17, 2023
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Weoun Gyuen Moon, Jae Hyun Kim, Kyu Soon Shin, Jong Dai Park, Min Gun Lee, Sung Hoon Jin, Goo Hwa Lee, Gyeong Sook Cho, Jae Hong Yoo
  • CHEMICAL-MECHANICAL POLISHING PARTICLE AND POLISHING SLURRY COMPOSITION COMPRISING SAME
    Publication number: 20210340405
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Application
    Filed: June 30, 2021
    Publication date: November 4, 2021
    Inventors: Weoun Gyuen MOON, Jae Hyun KIM, Kyu Soon SHIN, Jong Dai PARK, Min Gun LEE, Sung Hoon JIN, Goo Hwa LEE, Gyeong Sook CHO, Jae Hong YOO