Abstract: An encryption method, includes performing, by an encryption system, bit reversal permutation of pixel data of a 2D image, arranging the pixel data as first-pixel data, and applying the 2D image to a butterfly algorithm of fast Fourier transform; determining, by the encryption system, a plurality of data paths based on the first-pixel data; and performing, by the encryption system, a first encryption of the first-pixel data into second-pixel data on a specific data path based on a number of the specific data path among the plurality of data paths.

Abstract: A semiconductor light emitting device includes a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a transparent electrode layer on the second conductivity-type semiconductor layer and spaced apart from an edge of the second conductivity-type semiconductor layer, a first insulating layer on the light emitting structure to cover the transparent electrode layer and including a plurality of holes connected to the transparent electrode layer, and a reflective electrode layer on the first insulating layer and connected to the transparent electrode layer through the plurality of holes.

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Abstract: A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

Abstract: A pharmaceutical formulation including an immediate release layer and an extended release layer according to the present disclosure has a biphasic dissolution profile, such that it is possible to quickly reach an effective plasma concentration of cibenzoline at the early stage, and the effective plasma concentration may be continuously maintained at the late stage. Therefore, the medicinal effect of cibenzoline may be maintained only by an administration of a single formulation once a day.

Abstract: An encryption method, includes performing, by an encryption system, bit reversal permutation of pixel data of a 2D image, arranging the pixel data as first-pixel data, and applying the 2D image to a butterfly algorithm of fast Fourier transform; determining, by the encryption system, a plurality of data paths based on the first-pixel data; and performing, by the encryption system, a first encryption of the first-pixel data into second-pixel data on a specific data path based on a number of the specific data path among the plurality of data paths.

Abstract: A joining apparatus for panel sheets and a joining method for panel sheets using the same are provided. The joining apparatus includes an element punching device which stores and supplies elements according to a specification of a panel sheet and inserts the element into a first panel sheet among different types of panel sheets. Additionally, a welding device resistively welds a part of the first panel sheet into which the element is inserted by the element punching device.

Abstract: A lead (Pb)-free, and silver (Ag)-free solder alloy includes a primary metallic element in a content of about 1.1 wt % to about 1.9 wt %, nickel(Ni) in a content of about 0.02 wt % to about 0.09 wt %, copper (Cu) in a content of about 0.2 wt % to about 0.9 wt %, and tin (Sn) and other unavoidable impurities in remaining balance, wherein the primary metallic element is at least one selected from the group including bismuth (Bi), chromium (Cr), indium (In), antimony (Sb), silicon (Si) and zinc (Zn).

Abstract: A semiconductor package of a pin-grid-array type includes a bump pad on a first substrate, a metal socket on a second substrate, a core material for reverse reflow on the bump pad, and solder paste or a solder bump forming a solder layer on the core material for reverse reflow. The solder paste or the solder bump is in contact with the bump pad. The core material for reverse reflow and the solder paste or the solder bump bonded to the core material for reverse reflow are used as a pin and detachably attached to the metal socket. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Abstract: An apparatus for supplying a fastener for joining two different types of panels includes: a first bowl which accommodates fasteners of at least three specifications, aligns first fasteners of a first specification by a first guider, sequentially supplies the first fasteners to a supply unit through a first rail, and drops downward fasteners other than the first fasteners by a first dropping unit of the first guider; and a second bowl which is disposed at a lower side of the first bowl, accommodates the first fasteners dropped from the first bowl, aligns second fasteners of a second specification by a second guider, sequentially supplies the second fasteners to the supply unit through a second rail, and drops downward fasteners other than the second fasteners.

Abstract: A joining apparatus for panel sheets and a joining method for panel sheets using the same are provided. The joining apparatus includes an element punching device which stores and supplies elements according to a specification of a panel sheet and inserts the element into a first panel sheet among different types of panel sheets. Additionally, a welding device resistively welds a part of the first panel sheet into which the element is inserted by the element punching device.

Abstract: A joining apparatus for panel sheets and a joining method for panel sheets using the same are provided. The joining apparatus includes an element punching device which stores and supplies elements according to a specification of a panel sheet and inserts the element into a first panel sheet among different types of panel sheets. Additionally, a welding device resistively welds a part of the first panel sheet into which the element is inserted by the element punching device.

Abstract: An apparatus for supplying a fastener for joining two different types of panels includes: a first bowl which accommodates fasteners of at least three specifications, aligns first fasteners of a first specification by a first guider, sequentially supplies the first fasteners to a supply unit through a first rail, and drops downward fasteners other than the first fasteners by a first dropping unit of the first guider; and a second bowl which is disposed at a lower side of the first bowl, accommodates the first fasteners dropped from the first bowl, aligns second fasteners of a second specification by a second guider, sequentially supplies the second fasteners to the supply unit through a second rail, and drops downward fasteners other than the second fasteners.

Abstract: A joining apparatus for panel sheets and a joining method for panel sheets using the same are provided. The joining apparatus includes an element punching device which stores and supplies elements according to a specification of a panel sheet and inserts the element into a first panel sheet among different types of panel sheets. Additionally, a welding device resistively welds a part of the first panel sheet into which the element is inserted by the element punching device.

Abstract: An apparatus and a method recognizes stamped characters, detects stamped depths of characters using the same, and/or accurately recognizes characters even when an image distortion occurs at stamped portion due to different stamped depths of characters.

Abstract: A welding portion inspection system includes a sensing head, and first and second electrodes that are disposed a predetermined distance from each other at one side of the sensing head, where front end portions of the first and second electrodes contact both sides of a welding portion to apply current such that a temperature of the welding portion is heated, and an infrared camera is disposed on the sensing head and detects a temperature distribution of the welding portion.

Abstract: Provided are a reverse-reflow core, a semiconductor package, and a method of fabricating a semiconductor package. The semiconductor package includes: a semiconductor apparatus including a bump pad; and a bump portion bonded to the bump pad. The bump portion includes: a core; an intermetallic compound layer formed on the core; and a solder layer coating the intermetallic compound layer, wherein the thickness of a portion of the solder layer decreases as the distance between the portion of the solder layer and the bump pad increases. The reverse-reflow core, the semiconductor package, and the method of fabricating a semiconductor package enable the fabrication of a semiconductor package having high bonding strength and a high degree of precision.

Abstract: A solder ball includes about 1.0 wt % to about 2.0 wt % silver (Ag), about 4.0 wt % to about 8.0 wt % indium (In), about 10.0 wt % to about 20.0 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % deoxidizer, and the balance of tin (Sn). A melting point of the solder is about 170° C. to about 190° C.

Abstract: A solder ball for fluxless bonding includes a solder core, a first metal layer on a surface of the solder core, and a second metal layer on the first metal layer. The first metal layer includes at least one of nickel (Ni), silver (Ag), zinc (Zn), tin (Sn), chrome (Cr), antimony (Sb), platinum (Pt), palladium (Pd), aluminum (Al), or an alloy thereof. The second metal layer includes gold (Au). As the above solder ball for fluxless bonding is in use, a solder bump having high reliability may be formed via a relatively short, low cost, and simple process.