Patents by Inventor Jae Hwa Hong

Jae Hwa Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240084474
    Abstract: The present invention relates to a metal-polymer resin composite in which a polymer resin is directly injection-molded to a zinc alloy, a magnesium alloy, or a die-casting part thereof, and thus an injection product is directly bonded to a metal surface, wherein in the case of a hard polymer resin, a tensile strength of the metal and the polymer resin is 30 MPa or greater, and in the case of a soft polymer resin, a tensile strength of the metal and the polymer resin is 20 MPa or greater, and an average helium leakage after 10 times of measurement is 10?8 Pa·m3/s or less, and a novel method for preparing the same.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 14, 2024
    Applicant: PLASTAL CO., LTD.
    Inventors: Mu Chang SUNG, Jae Ik KIM, Jae Hwa KIM, Sung Ho HONG
  • Patent number: 11242366
    Abstract: According to aspects of the present invention, a peptide with any one sequence of SEQ ID NOS:1 to 3 exhibits high selective binding affinity to a target and the microcapsule has superior physicochemical stability. Therefore, the cosmetic composition containing the microcapsule linked to the peptide manifests high delivery efficiency of an active ingredient included in the capsule to target cells, thereby exhibiting superior skin-condition improvement effects.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: February 8, 2022
    Assignee: KOLMAR KOREA CO., LTD.
    Inventors: Sang Keun Han, Hyun Sook Lee, Eun Ah Kim, Seung Min Hyun, Hyeong Choi, So Yoon Baek, Jae Hwa Hong, Chae Mi Lim, Da Jeong Bak, Hye Jin Jo, Hak Sung Lee, Ji Hun Park, Eun Young Lee
  • Publication number: 20200190143
    Abstract: According to aspects of the present invention, a peptide with any one sequence of SEQ ID NOS:1 to 3 exhibits high selective binding affinity to a target and the microcapsule has superior physicochemical stability. Therefore, the cosmetic composition containing the microcapsule linked to the peptide manifests high delivery efficiency of an active ingredient included in the capsule to target cells, thereby exhibiting superior skin-condition improvement effects.
    Type: Application
    Filed: January 19, 2018
    Publication date: June 18, 2020
    Inventors: Sang Keun HAN, Hyun Sook LEE, Eun Ah KIM, Seung Min HYUN, Hyeong CHOI, So Yoon BAEK, Jae Hwa HONG, Chae Mi LIM, Da Jeong BAK, Hye Jin JO, Hak Sung LEE, Ji Hun PARK, Eun Young LEE
  • Patent number: 10458031
    Abstract: An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 ?m or less (except O ?m), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: October 29, 2019
    Assignee: POSCO
    Inventors: Gwan-Ho Jung, Jin-You Kim, Moo-Jin Kim, Jae-Kon Lee, Jun-Hak Park, Jae-Hwa Hong
  • Publication number: 20170342581
    Abstract: An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 ?m or less (except O ?m), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.
    Type: Application
    Filed: March 25, 2015
    Publication date: November 30, 2017
    Inventors: Gwan-Ho JUNG, Jin-You KIM, Moo-Jin KIM, Jae-Kon LEE, Jun-Hak PARK, Jae-Hwa HONG
  • Publication number: 20160320310
    Abstract: An apparatus for simultaneously measuring whiteness and coating amount, according to one embodiment of the present invention, comprises: a light-emitting unit arranged at a predetermined distance from a test piece and irradiating the test piece with light; a filter unit arranged between the light-emitting unit and the test piece and allowing either an infrared ray or a visible ray to selectively pass therethrough; a detection unit arranged at a predetermined distance from the test piece and detecting either the infrared ray or the visible ray to be reflected from the test piece; and a calculation unit connected with the detection unit, calculating the coating amount according to the amount of the infrared ray detected by the detection unit, and calculating the whiteness according to the amount of the visible ray detected by the detection unit.
    Type: Application
    Filed: December 26, 2013
    Publication date: November 3, 2016
    Inventor: Jae Hwa HONG
  • Patent number: 7172660
    Abstract: A method for making an amorphous soft magnetic core using Fe-based amorphous metal powders is provided. The amorphous soft magnetic powders are obtained by crushing amorphous ribbons produced using a rapid solidification process (RSP). The magnetic core is obtained by performing a preliminary thermal treatment of amorphous metal ribbons made of Fe-based amorphous metal alloy using RSP, crushing the amorphous metal ribbons to thereby obtain amorphous metal powders, classifying the amorphous metal powders to then be mixed into a distribution of powder particles having an optimal uniform composition, mixing the mixed amorphous metal powders with a binder, forming a core, and annealing the formed core to then coat the core with an insulating resin.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: February 6, 2007
    Assignee: Amosense Co., Ltd.
    Inventors: Yong Sul Song, Jae Hwa Hong, Hie Jin Kim