Patents by Inventor Jae Hyuk Ahn

Jae Hyuk Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12015216
    Abstract: What is discussed is an interconnection member including (a) a main cable made of a flexible flat cable (FFC) including copper wires, (b) terminal parts branched from the main cable and electrically connected to at least one of the copper wires of the main cable, (c) a connecting part formed on one-side end of the main cable, and electrically and mechanically connected to a PCB and (d) at least one temperature sensing part branched from the main cable, wherein the at least one temperature sensing part comprises a first extending part extending from the main cable while sharing at least one copper wire of the copper wires of the main cable and a ceramic thermistor disposed on an end of the first extending part while being electrically connected to the first extending part.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 18, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Jae Hyeon Ju, Jin Hong Park, Sang Hyuk Ma, Hyung Jun Ahn, Bo Hyon Kim
  • Publication number: 20240182525
    Abstract: The present invention provides a compound represented by chemical formula 1, an optical isomer thereof or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition for preventing or treating Wnt/?-catenin signaling-associated diseases, comprising same.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 6, 2024
    Applicant: KOREARESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHNOLOGY
    Inventors: Jong Seog AHN, Jun Pil JANG, Jae-Hyuk JANG, Sung-Kyun KO, Min Cheol KWON, Gui Ja HWANG, Jae-Won LEE
  • Patent number: 8389225
    Abstract: The present invention relates to a bio-silica chip comprising a silica-binding protein and a fabrication method thereof, and more particularly to a bio-silica chip in which a fusion protein of a silica-binding protein and a probe protein is immobilized on a chip comprising a silica layer, a fabrication method thereof and a method of using the bio-silica chip to detect interactions with biomaterials. The bio-silica chip will be very useful in biosensors, etc., because the bio-silica chip is advantageous in that it does not cause non-specific protein binding in the detection of protein-DNA, protein-ligand, protein-antibody, protein-peptide, protein-carbohydrate, protein-protein and cell-biomaterial interactions. Also, in the method for fabricating the bio-silica chip, a probe chip can be selectively immobilized on a silica device chip, which is widely used in biosensors, without a chemical surface treatment process.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: March 5, 2013
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Sang Yup Lee, Tae Jung Park, Yang Kyu Choi, Bon Sang Gu, Jae Hyuk Ahn
  • Publication number: 20100035362
    Abstract: The present invention relates to a bio-silica chip comprising a silica-binding protein and a fabrication method thereof, and more particularly to a bio-silica chip in which a fusion protein of a silica-binding protein and a probe protein is immobilized on a chip comprising a silica layer, a fabrication method thereof and a method of using the bio-silica chip to detect interactions with biomaterials. The bio-silica chip will be very useful in biosensors, etc., because the bio-silica chip is advantageous in that it does not cause non-specific protein binding in the detection of protein-DNA, protein-ligand, protein-antibody, protein-peptide, protein-carbohydrate, protein-protein and cell-biomaterial interactions. Also, in the method for fabricating the bio-silica chip, a probe chip can be selectively immobilized on a silica device chip, which is widely used in biosensors, without a chemical surface treatment process.
    Type: Application
    Filed: March 24, 2009
    Publication date: February 11, 2010
    Inventors: Sang Yup Lee, Tae Jung Park, Yang Kyu Choi, Bon Sang Gu, Jae Hyuk Ahn