Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.

Abstract: A sterilizing device includes a pipe having an inlet and an outlet and allowing fluid to move therethrough and a light source provided on one side of the pipe and providing light to the fluid. At least a portion of the pipe is provided in a spiral shape and the inlet and/or the outlet are arranged in a light emitting region.

Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus that perform inter-prediction using a motion vector predictor. For a candidate block in a col picture, a scaled motion vector is generated based on a motion vector of the candidate block. When the scaled motion vector indicates a target block, a motion vector predictor of the target block is generated based on the motion vector of the candidate block. The motion vector predictor is used to derive the motion vector of the target block in a specific inter-prediction mode such as a merge mode and an AMVP mode.

Abstract: A semiconductor memory device includes a tunnel insulating layer, a data storage layer, and a blocking insulating layer that are sequentially disposed. The tunnel insulating layer includes Metal Organic Frameworks (MOF) having a lower dielectric constant than a dielectric constant of the blocking insulating layer.

Abstract: An automation method of an artificial intelligence (AI)-based diagnostic technology for equipment application includes receiving one or more pieces of data among vibration data, noise data, and controller area network (CAN) data, a data input processing operation of trimming the input data, an operation of extracting features from the trimmed data, setting a setting value of a hyper-parameter with respect to the one or more pieces of data thereamong, and generating a total of N models to include both of machine learning (ML) and deep learning (DL) as N individual models and generating ensemble prediction model structures for the N individual models. As a parameter updating is being proceeded due to the hyper-parameter so as to minimize values of cost functions of the N individual models, a reward for model accuracy performance is optimized and the ensemble prediction model structures of the N individual models change.

Abstract: A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.

Abstract: A display panel includes: first and second pixel circuits each including a transistor and a capacitor, and first and second light emitting elements electrically connected to the first and second pixel circuits, respectively. The first light emitting element is spaced apart from the capacitors of the first and second pixel circuits in a plan view, and the second light emitting device overlaps the capacitors of the first and second pixel circuits in the plan view.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging surface of an image sensor, wherein a conditional expression f/f2+f/f3<?0.4 is satisfied, where f is a focal length of the optical imaging system, f2 is a focal length of the second lens, and f3 is a focal length of the third lens, and a conditional expression TTL/(2*IMG HT)<0.69 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging surface of the image sensor, and IMG HT is one-half of a diagonal length of the imaging surface of the image sensor.

Abstract: An image processing device including: a decision pixel manager for setting a decision area for a defect candidate pixel, and determining a first decision pixel and a second decision pixel, based on first phase information of pixels included in the decision area with respect to a first modulation frequency of a sensing light source among the pixels; a target pixel determiner for calculating a phase difference between the first decision pixel and the second decision pixel, based on second phase information of the pixels with respect to a second modulation frequency of the sensing light source, and determining the defect candidate pixel as a target pixel, corresponding to that the phase difference exceeds a predetermined reference value; and a phase corrector for changing a phase of the target pixel, based on the phase difference.

Abstract: A super junction semiconductor device includes a substrate of a first conductive type, an epitaxial layer disposed on the substrate, a plurality of pillars extending in a vertical direction and each being alternately arranged within the epitaxial layer, gate structures disposed on the epitaxial layer in the active region, a reverse recovery layer of a second conductive type, the reverse recovery layer disposed on both the pillars and the epitaxial layer and in the transition region to distribute a reverse recovery current, and at least one high concentration region surrounding an upper portion of at least one of the pillars in the peripheral region, the high concentration region having a horizontal width greater than that of one of the pillars provided in the transition region. Thus, a breakdown voltage may be inhibited from decreasing in the peripheral region.

Abstract: A chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.

Abstract: A smart anchor-based position estimation method and apparatus are disclosed. The position estimation method, performed by a position estimation apparatus, includes: identifying one or more line-of-sight (LOS) anchors from among one or more anchors mounted in a vehicle; selecting reference anchors from among the one or more LOS anchors; and estimating a position of a tag based on a number of the reference anchors. The reference anchors are selected based on a rate of formation of an ultra-wideband (UWB) link to the tag and accuracy of the estimated position of the tag.

Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.

Abstract: Disclosed are a method and apparatus for processing source data of a synthetic aperture radar in a satellite, including receiving source data generated based on a signal returned after an electronic device steers a beam from a synthetic aperture radar and backscatters, setting a plurality of subswaths after the electronic device parses the source data, storing based on the plurality of subswaths after the electronic device decodes the source data; and generating image data after the electronic device calls the decoded source data in the order of the plurality of subswaths.

Abstract: The present invention relates to a fusion protein comprising a SARS-CoV-2-derived receptor-binding domain and a nucleocapsid protein, and the use thereof. The fusion protein comprising a coronavirus-derived receptor-binding domain and a nucleocapsid protein is highly applicable to a multivalent vaccine composition having greatly improved in-vivo half-life and remarkably superior efficacy compared to an immunogenic composition comprising only a receptor-binding domain. In particular, the fusion protein can greatly improve the titer of the coronavirus-specific antibody formation and T-cell immune response, and is thus useful for the prevention and treatment of coronaviruses comprising SARS-CoV-2.

Abstract: A light device including a substrate, and first and second light emitters spaced apart from each other, and a power source to control the first light emitter and the second light emitter, in which the first and second light emitters include a light emitting region, a wavelength conversion layer disposed on the light emitting region, and a lateral reflection layer covering a region of a side of the light emitting region and the wavelength conversion layer, the first light emitter and the second light emitter are configured to output the same or different magnitudes of power by receiving the same or different magnitudes of current, the first and second light emitters are respectively configured to emit first light and second light, the first light emitter is electrically connected to the second light emitter through a common electrode.

Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, sequentially arranged from an object side, wherein the first lens has a positive refractive power, wherein the second lens has a negative refractive power, wherein the third lens has a refractive power, wherein the fourth lens has a refractive power, wherein the fifth lens has a refractive power, and wherein 2.0<f/(2×IMG HT)<3.0, and 0.16<D2/|f2|<0.3, where f is an overall focal length of the first lens to the fifth lens, IMG HT is half of a diagonal length of an imaging plane, D2 is a distance along an optical axis from an image-side surface of the second lens to an object-side surface of the third lens distance, and f2 is a focal length of the second lens.

Abstract: A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.

Abstract: A sidestream smoke removal device and a control method thereof are provided. The sidestream smoke removal device according to some embodiments of the present disclosure may include a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, and a heating portion disposed inside the housing to heat the smoking space. The heating portion may heat the smoking space to remove a smell generated due to by-products of smoking, and accordingly, the cleanliness of the sidestream smoke removal device can be improved.