Patents by Inventor Jae Hyun Chang

Jae Hyun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9923261
    Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: March 20, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Min Jin, Min Hoon Kim, Eun Kyoung Kim, Seung Goo Jang, Hyung Geun Ji, Jae Hyun Chang
  • Publication number: 20160302303
    Abstract: A mounting board module includes a board; a circuit unit disposed on a first side of the board; and a power supply unit disposed a second side of the board, opposite the first and configured to supply power to the circuit unit, wherein the board comprises a ground layer disposed between the circuit unit and the power supply unit, wherein the ground layer is configured to be electrically grounded.
    Type: Application
    Filed: March 21, 2016
    Publication date: October 13, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Hoon KIM, Se Min JIN, Jae Hyun CHANG
  • Publication number: 20160276734
    Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
    Type: Application
    Filed: January 11, 2016
    Publication date: September 22, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Min JIN, Min Hoon KIM, Eun Kyoung KIM, Seung Goo JANG, Hyung Geun JI, Jae Hyun CHANG
  • Publication number: 20160104934
    Abstract: An antenna includes: a board including layers; a main antenna pattern formed on a layer among the layers, and including two main patterns spaced apart from each other; and dummy patterns formed in the board and insulated from the main antenna pattern.
    Type: Application
    Filed: October 9, 2015
    Publication date: April 14, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Goo JANG, Se Min JIN, Eun Kyoung KIM, Min Hoon KIM, Hyung Geun JI, Jae Hyun CHANG
  • Publication number: 20120231118
    Abstract: Disclosed is a method for preparing a soybean paste including: flaking or crushing raw soybeans, immersing the resulting flaked or crushed soybeans in water, followed by cooking and cooling, homogeneously mixing the soybeans with koji bacteria and a bean or grain powder, followed by fermenting and drying, and mixing the meju with table salt and distilled water and aging the resulting mixture. In accordance with the method, the soybeans are flaked or crushed to advantageously reduce hydrating and cooking periods of soybeans, form cracks on the soybean surfaces and increase surface areas, and allow beneficial microorganisms to easily use nutrients contained in soybeans, thus increase enzyme production, considerably reduce fermentation period of meju and aging period of soybean paste, obtain manufacturing soybean pastes with superior quality and improve production efficiency.
    Type: Application
    Filed: October 18, 2010
    Publication date: September 13, 2012
    Inventors: Eun Seok Jang, Jae Hyun Chang, Sung Hun Lee, Hye Won Shin, Won Dae Chung, Kang Pyo Lee
  • Patent number: RE49261
    Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 25, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Se Min Jin, Min Hoon Kim, Eun Kyoung Kim, Seung Goo Jang, Hyung Geun Ji, Jae Hyun Chang